Lens moving apparatus, and camera module and optical device comprising same

ABSTRACT

An embodiment comprises: a housing; a bobbin disposed in the housing; a first coil disposed on the bobbin; a magnet disposed on the housing; a first sensing coil, disposed on the housing, for generating a first induced voltage by interacting with the first coil; a first circuit board connected to the first coil and the first sensing coil; and a first amplifier, disposed on the first circuit board, for amplifying the first induced voltage of the first sensing coil and outputting a first amplified signal.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.17/165,320, filed Feb. 2, 2021; which is the continuation of U.S.application Ser. No. 16/338,375, filed Mar. 29, 2019, now U.S. Pat. No.10,951,799, issued Mar. 16, 2021; which is the U.S. national stageapplication of International Patent Application No. PCT/KR2017/010607,filed Sep. 26, 2017; which claims the benefit under 35 U.S.C. § 119 ofKorean Application Nos. 10-2016-0126745, filed Sep. 30, 2016;10-2016-0168532, filed Dec. 12, 2016; and 10-2016-0168533, filed Dec.12, 2016; all of which are hereby incorporated by reference in theirentirety.

TECHNICAL FIELD

Embodiments relate to a lens moving apparatus and a camera module andoptical instrument including the same.

BACKGROUND ART

Since it is difficult to apply technology of a voice coil motor (VCM)used in a general camera module to a subminiature camera module forlow-power consumption, research related thereto has been activelyconducted.

In the case of a camera module mounted in a small electronic apparatussuch as a smartphone, the camera module may be frequently impactedduring use or may be slightly shaken due to hand tremor duringphotographing. Considering this, in recent years, technology foradditionally providing a handshake inhibition unit to a camera modulehas been developed.

DISCLOSURE Technical Problem

Embodiments provide a lens moving apparatus capable of reducing noise ofa voltage induced in a second coil and improving accuracy of autofocusoperation, and a camera module and optical instrument including thesame.

Technical Solution

In an embodiment, a lens moving apparatus includes a housing, a bobbindisposed in the housing, a first coil disposed on the bobbin, a magnetdisposed on the housing, a first sensing coil disposed on the housing togenerate a first induced voltage by interaction with the first coil, afirst circuit board electrically connected to the first coil and thefirst sensing coil, and a first amplifier disposed on the first circuitboard to amplify the first induced voltage of the first sensing coil andto output a first amplified signal.

The first amplifier may include a first input terminal electricallyconnected with one end of the first sensing coil, a second inputterminal electrically connected with the other end of the first sensingcoil, an output terminal configured to output the first amplifiedsignal, a first power terminal configured to receive first power, and asecond power terminal configured to receive second power.

The first circuit board may include a first terminal electricallyconnected to the output terminal, a second terminal electricallyconnected to the first power terminal, a third terminal electricallyconnected to the second power terminal, a first dummy terminal disposedbetween the first terminal and the second terminal, and a second dummyterminal disposed between the first terminal and the third terminal.

The first terminal may be disposed between the second terminal and thethird terminal.

The first circuit board may include a first terminal electricallyconnected to the output terminal, a second terminal electricallyconnected to the first power terminal, and a third terminal electricallyconnected to the second power terminal, the second and third terminalsmay be disposed at one side of the first terminal, the third terminalmay be disposed between the first terminal and the second terminal, thefirst power may be connected to a first positive voltage, and the secondpower may be connected to a second negative voltage.

The first circuit board may further include a dummy terminal disposedbetween the first terminal and the third terminal.

A driving signal which is an alternating current (AC) signal may beapplied to the first coil.

The lens driving apparatus may further include a second sensing coildisposed in the housing to generate a second induced voltage byinteraction with the first coil, and a detector configured to receivethe first induced voltage and the second induced voltage and to detectdisplacement of the bobbin.

The detector may determine noise generated in at least one of the firstsensing coil or the second sensing coil based on the result of comparingthe first induced voltage with the second induced voltage and detect andcontrol displacement of the bobbin based on the result of determination.

The first sensing coil and the second sensing coil may be connected toeach other in series, an intermediate tap may be provided at a contactpoint between one end of the first sensing coil and one end of thesecond sensing coil, and ground power may be supplied to theintermediate tap.

Advantageous Effects

Embodiments can reduce noise of a voltage induced by a second coil andimprove accuracy of autofocus operation.

DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view of a lens moving apparatus according to anembodiment.

FIG. 2 is an exploded perspective view of the lens moving apparatusshown in FIG. 1.

FIG. 3 is an assembled perspective view of the lens moving apparatus ofFIG. 1 except for a cover.

FIG. 4a is a first perspective view of a bobbin and a first coil shownin FIG. 1.

FIG. 4b is a second perspective view of the bobbin and the first coilshown in FIG. 1.

FIG. 5a is a first perspective view of a housing shown in FIG. 1.

FIG. 5b is a second perspective view of the housing shown in FIG. 1.

FIG. 6 is a cross-sectional view of the lens moving apparatus shown inFIG. 3 taken along line A-B.

FIG. 7 is an assembled perspective view of an upper elastic member, alower elastic member, a third coil, a circuit board and a base of FIG.2.

FIG. 8 is an exploded perspective view of the third coil, the circuitboard, the base, first and second position sensors and an amplifier.

FIG. 9a is a view showing the first and second position sensors and theamplifier mounted on the circuit board.

FIG. 9b is a view showing an conductible connection relationship betweenthe second coil and the amplifier.

FIG. 10 is a view showing conductible connection between supportingmembers and the amplifier and conductible connection between theamplifier and terminals of the circuit board.

FIG. 11 is a view showing conductible connection between supportingmembers and the amplifier and conductible connection between theamplifier and terminals of the circuit board according to anotherembodiment.

FIG. 12 is a view showing a driving signal of the first coil, an inducedvoltage of the second coil and an amplified signal of the amplifier.

FIG. 13 is a view showing mutual inductance according to a distancebetween the first coil and the second coil.

FIG. 14a is a view showing arrangement of first to third terminalsaccording to another embodiment.

FIG. 14b is a view showing arrangement of first to third terminals andfirst and second dummy terminals according to another embodiment.

FIGS. 15a and 15b are block diagrams showing amplification of theinduced voltage of the second coil by the amplifier of the lens movingapparatus and an amplifier of a camera module.

FIG. 16 is an exploded perspective view of a lens moving apparatusaccording to another embodiment.

FIG. 17 is an assembled perspective view of the lens moving apparatus ofFIG. 16 except for a cover.

FIG. 18a is a first perspective view of a bobbin shown in FIG. 16.

FIG. 18b is a second perspective view of the bobbin shown in FIG. 16.

FIG. 19a is a first perspective view of a housing shown in FIG. 16.

FIG. 19b is a second perspective view of the housing shown in FIG. 16.

FIG. 20 is a cross-sectional view of the lens moving apparatus shown inFIG. 17 taken along line A-B.

FIG. 21 is an assembled perspective view of an upper elastic member, alower elastic member, a third coil, a circuit board, a base and asupporting member of FIG. 16.

FIG. 22 is an exploded perspective view of the third coil, the circuitboard, the base, and first and second position sensors.

FIGS. 23a to 23b are views showing embodiments of arrangement of a firstsensing coil and a second sensing coil disposed in the housing of FIG.17.

FIG. 24a is a view showing arrangement of a first sensing coil and asecond sensing coil according to another embodiment.

FIG. 24b is a perspective view except for the first sensing coil and thesecond sensing coil of FIG. 24 a.

FIG. 24c is a view showing an embodiment of the first sensing coil andthe second sensing coil shown in FIG. 24 a.

FIGS. 25a and 25b are views showing embodiments of the first coil, thefirst sensing coil and the second sensing coil shown in FIG. 16.

FIGS. 26a and 26b are views showing embodiments of the waveforms of thefirst induced voltage of the first sensing coil and the second inducedvoltage of the second sensing coil generated in response to a firstdriving signal.

FIG. 27 is a view showing an embodiment of a detector shown in FIG. 22.

FIG. 28 is a view showing another embodiment of the detector shown inFIG. 22.

FIG. 29 is an exploded perspective view of a camera module according toanother embodiment.

FIGS. 30a and 30b are views showing embodiments of a first coil andfirst and second sensing coils for temperature compensation.

FIGS. 31a to 31d are views showing embodiments of a first voltagegenerated in the first sensing coil and a second voltage generated inthe second sensing coil according to the first driving signal and thesecond driving signal of FIGS. 30a and 30 b.

FIG. 32 is a view showing change in first or second induced voltagegenerated in the first sensing coil or the second sensing coil shown inFIGS. 25a and 25b according to ambient temperature.

FIG. 33 is a view showing a capacitor for removing a noise component.

FIG. 34 is a perspective view of a lens moving apparatus according to anembodiment.

FIG. 35 is an exploded perspective view of the lens moving apparatusshown in FIG. 34.

FIG. 36 is an assembled perspective view of the lens moving apparatus ofFIG. 34 except for a cover member of FIG. 35.

FIG. 37a is a first perspective view of a bobbin and a first coil shownin FIG. 34.

FIG. 37b is a second perspective view of the bobbin and the first coilshown in FIG. 34.

FIG. 38a is a first perspective view of a housing shown in FIG. 34.

FIG. 38b is a second perspective view of the housing shown in FIG. 34.

FIG. 39 is a cross-sectional view of the lens moving apparatus shown inFIG. 36 taken along line A-B.

FIG. 40 is an assembled perspective view of an upper elastic member, alower elastic member, a third coil, a circuit board, and a base of FIG.35.

FIG. 41 is an exploded perspective view of the third coil, the circuitboard, the base and first and second OIS position sensors.

FIG. 42 is a cross-sectional view of a lens moving apparatus accordingto another embodiment.

FIG. 43 is a cross-sectional view of a lens moving apparatus accordingto another embodiment.

FIG. 44 is a first bottom perspective view of a circuit board shown inFIG. 43.

FIG. 45 is a second bottom perspective view of a circuit board shown inFIG. 44.

FIG. 46 is a partially enlarged view of a terminal member shown in FIG.44.

FIG. 47 is a cross-sectional view of the terminal member shown in FIG.44 taken along line A-B.

FIG. 48 is a bottom perspective view of a base according to anembodiment.

FIG. 49 is a partially enlarged view of the base of FIG. 48 coupled witha circuit board.

FIG. 50 is a view showing a solder disposed between a terminal member ofa lens moving apparatus according to an embodiment and a pad of a secondholder of a camera module including the same.

FIG. 51 is a block diagram showing an embodiment of an image sensorshown in FIGS. 15b and 29.

FIG. 52 is a perspective view of a portable terminal according to anembodiment.

FIG. 53 is a diagram showing the configuration of the portable terminalshown in FIG. 52.

BEST MODE

Hereinafter, embodiments will be described in detail with reference tothe accompanying drawings. In description of the embodiments, it will beunderstood that, when an element such as a layer (film), region, patternor structure is referred to as being formed “on” or “under” anotherelement, such as a substrate, layer (film), region, pad or pattern, itcan be directly “on” or “under” the other element or be indirectlyformed with intervening elements therebetween. It will also beunderstood that “on” and “under” the element is described relative tothe drawings.

In the drawings, dimensions may be exaggerated, omitted or schematicallyillustrated for convenience and clarity of description. In addition, thesize of each element does not entirely reflect an actual size. The samereference numbers will be used throughout the specification to refer tothe same or like constituent elements.

For convenience of description, a lens moving apparatus according to anembodiment is described using the Cartesian coordinate system (x, y, z),but may be described using another coordinate system, and the embodimentis not limited thereto. In the drawings, x- and y-axes indicatedirections perpendicular to a z-axis, which is an optical axisdirection. The optical axis or a z-axis direction parallel to theoptical axis may be referred to as a “first direction”, an x-axisdirection may be referred to as a “second direction”, and a y-axisdirection may be referred to as a “third direction”.

A “handshake correction device” applied to a small camera module of amobile device such as a smartphone or a tablet PC may mean a deviceconfigured to inhibit the outline of a captured image from being blurreddue to vibration by handshake of a user at the time of capturing a stillimage.

In addition, an “autofocusing device” is a device for automaticallyfocusing and forming an image of a subject on an image sensor surface.The handshake correction device and the autofocusing device may bevariously configured. A lens moving apparatus according to an embodimentmay move an optical module including at least one lens in a firstdirection parallel to an optical axis or relative to a surface formed bysecond and third directions perpendicular to the first direction,thereby performing handshake correction operation and/or autofocusoperation.

FIG. 1 is a perspective view of a lens moving apparatus 100 according toan embodiment, FIG. 2 is an exploded perspective view of the lens movingapparatus 100 shown in FIG. 1, and FIG. 3 is an assembled perspectiveview of the lens moving apparatus 100 of FIG. 1 except for a cover 300.

Referring to FIGS. 1 to 3, the lens moving apparatus 100 includes abobbin 110, a first coil 120, a magnet 130, a housing 140, an upperelastic member 150, a lower elastic member 160, a second coil 170, asupporting member 220, a third coil 230, a circuit board 250, positionsensors 240 and an amplifier 310.

The lens moving apparatus 100 may further include a cover member 300 anda base 210.

First, the cover member 300 will be described.

The cover member 300 receives other elements 110 to 170 and 220 to 250in a reception space formed together with the base 210.

The cover member 300 may be a box having an open lower portion andincluding an upper plate and side plates, a lower portion of the covermember 300 may be coupled with an upper portion of the base 210. Theshape of an upper end of the cover member 300 may be polygonal, forexample, rectangular or octagonal.

The cover member 300 may include a hollowness formed in the upper platethereof to expose a lens (not shown) coupled to the bobbin 110 toexternal light. In addition, a window made of a light transmissivematerial may be further provided in the hollowness of the cover member300 in order to inhibit foreign materials such as dust or moisture frompermeating into a camera module.

The cover member 300 may be made of a nonmagnetic material such as SUSin order to inhibit the cover member from being adhered to the magnet130 or may be made of a magnetic material to function as a yoke.

Next, the bobbin 110 will be described.

The bobbin 110 is disposed inside the housing 140.

FIG. 4a is a first perspective view of the bobbin 110 and the first coil120 shown in FIG. 1, and FIG. 4b is a second perspective view of thebobbin 110 and the first coil 120 shown in FIG. 1.

Referring to FIGS. 4a and 4b , the bobbin 110 may include a firstprotrusion 111 protruding from an upper surface thereof in a firstdirection and a second protrusion 112 protruding from an outercircumferential surface of the bobbin 110 in a second direction and/or athird direction.

The first protrusion 111 of the bobbin 110 may include a guide portion111 a and a first stopper 111 b. The guide portion 111 a of the bobbin110 serves to guide the installation position of the upper elasticmember 150. For example, the guide portion 111 a of the bobbin 110 mayguide a first frame connector 153 of the upper elastic member 150.

The second protrusion 112 of the bobbin 110 may protrude from the outercircumferential surface 110 b of the bobbin 110 in the second directionand/or the third direction perpendicular to the first direction.

In addition, a first upper supporting projection 113 engaged with athrough-hole 151 a of a first inner frame 151 of the upper elasticmember 150 may be provided on an upper surface of the bobbin 110.

The first stopper 111 b and the second protrusion 112 of the bobbin 110may serve to inhibit the upper surface of the bobbin 110 from directlycolliding with the inside of the cover member 300 even when the bobbin110 moves beyond a prescribed range by external impact in the case wherethe bobbin 110 moves in the first direction for the autofocus function.

The bobbin 110 may include a first lower supporting projection 117formed on a lower surface thereof to be engaged with and fixed to thethrough-hole 161 a of the lower elastic member 160.

The bobbin 110 may include a second stopper 116 protruding from thelower surface thereof. The second stopper 116 may serve to inhibit thelower surface of the bobbin 110 from directly colliding with the base210, the third coil 230 or the circuit board 250 even when the bobbin110 moves beyond a prescribed range by external impact in the case wherethe bobbin 110 moves in the first direction for the autofocus function.

The outer circumferential surface 110 b of the bobbin 110 may includefirst side portions 110 b-1 (or first side surfaces) and second sideportions 110 b-2 (or second side surfaces) located between the firstside portions 110-1.

The first side portions 110 b-1 of the bobbin 110 may correspond to orbe opposite to the magnet 130. Each of the second side portions 110-b ofthe bobbin 110 may be disposed between two adjacent first side portions.

The outer circumferential surface of each of the first side portions 110b-1 of the bobbin 110 may be planar and the outer circumferentialsurface of each of the second side portions 110 b-2 may be curved,without being limited thereto.

The bobbin 110 may include at least one first coil groove (not shown),in which the first coil 120 is disposed or installed, in the outercircumferential surface 110 b thereof. For example, the first coilgrooves may be provided in the first side portions and the second sideportions of the bobbin 110. The shape and number of first coil groovesmay correspond to the shape and number of first coils 120 disposed onthe outer circumferential surface 110 b of the bobbin 110. In anotherembodiment, the bobbin 110 may not include the first coil groove and thefirst coil 120 may be directly wound on and fixed to the outercircumferential surface of the bobbin 110.

Next, the first coil 120 will be described.

The first coil 120 may be disposed on the outer circumferential surface110 b of the bobbin 110, and may be an auto focus (AF) driving coil forperforming electromagnetic interaction with the magnet 130 disposed inthe housing 140.

In order to generate electromagnetic force by interaction with themagnet 130, a driving signal (e.g., driving current or voltage) may beapplied to the first coil 120.

The driving signal applied to the first coil 120 may be an AC signal,e.g., AC current. For example, the driving signal provided to the firstcoil 120 may be a sine wave signal or a pulse signal (e.g., a pulsewidth modulation (PWM) signal).

In another embodiment, the driving signal applied to the first coil 120may include an AC signal and a DC signal. The AC signal, e.g., ACcurrent, is applied to the first coil 120, in order to induceelectromotive force or a voltage in the second coil 172 by mutualinduction.

By electromagnetic force due to interaction between the first coil 120and the magnet 130, an AF movable portion may move in the firstdirection.

By controlling the driving signal applied to the first coil 120 tocontrol electromagnetic force due to interaction between the first coil120 and the magnet 130, it is possible to control movement of the AFmovable portion in the first direction and thus to perform an autofocusfunction.

The AF movable portion may include the bobbin 110 elastically supportedby upper and lower elastic members 150 and 160 and elements installed inthe bobbin 110 to move along with the bobbin 110. For example, the AFmovable portion may include the bobbin 110, the first coil 120, and alens (not shown) installed in the bobbin 110.

The first coil 120 may be wound to surround the outer circumferentialsurface of the bobbin 110 to rotate about an optical axis in a clockwiseor counterclockwise direction.

In another embodiment, the first coil 120 may be implemented in a closedloop shape wound clockwise or counterclockwise about an axisperpendicular to the optical axis, e.g., a coil ring shape, and thenumber of coil rings may be equal to the number of magnets 130, withoutbeing limited thereto.

The first coil 120 may be electrically connected to at least one of theupper or lower elastic members 150 or 160 and may be electricallyconnected to the circuit board 250 through the upper or lower elasticmember 150 or 160 and the supporting members 220.

The housing 140 receives the bobbin 110, in which the first coil 120 isdisposed.

FIG. 5a is a first perspective view of the housing 140 shown in FIG. 1,FIG. 5b is a second perspective view of the housing 140 shown in FIG. 1,and FIG. 6 is a cross-sectional view of the lens moving apparatus 100shown in FIG. 3 taken along line A-B.

Referring to FIGS. 5a, 5b and 6, the housing 140 may have a hollowpillar shape and may include the plurality of side portions 141 andsecond side portions 142 forming the hollowness.

For example, the housing 140 may include the first side portions 141spaced apart from each other and the second side portions 142 spacedapart from each other. The first side portions 141 of the housing 140may be replaced with “side portions” and the second side portions 142 ofthe housing 140 may be replaced with “corner portions”.

Each of the first side portions 141 of the housing 140 may be disposedor located between two adjacent second side portions 142 to connect thesecond side portions 142 to each other, and may include a plane having acertain depth.

The magnet 130 may be disposed or installed on the first side portions141 of the housing 140, and a supporting member 220 may be disposed onthe second side portions 142 of the housing 140.

The housing 140 may include a magnet seating portion 141 a provided inthe inner surfaces of the first side portions 141 in order to support orreceive the magnets 130-1 to 130-4.

The housing 140 may include second coil seating grooves 148 for windingor accommodating the second coil 170.

The second coil seating grooves 148 of the housing 140 may be recessedfrom the outer surfaces of the first side portions 141 and the secondside portions 142 of the housing 140.

For example, the second coil seating grooves 148 of the housing 140 maybe provided on the upper ends of the outer surfaces of the first andsecond side portions 141 and 142.

For example, the second coil seating grooves 148 of the housing 140 maybe spaced apart from the upper surface of the housing 140 to be providedin the outer surfaces of the first and second side portions 141 and 142,without being limited thereto.

The first side portions 141 of the housing 140 may be disposed inparallel to the side plate of the cover member 300. A through-hole 147a, through which the supporting member 220 passes, may be provided inthe second side portions 142 of the housing 140.

In addition, a second stopper 144 may be provided on the upper surfaceof the housing 140, in order to inhibit direct collision with the innersurface of the cover member 300.

The housing 140 may include at least one second upper supportingprojection 143 on the upper surfaces of the second side portions 142,for engagement with the through-hole 152 a of the first outer frame 152of the upper elastic member 150, and second lower supporting projections145 on the lower surfaces of the second side portions 142, forengagement with and fixing to the through-hole 162 a of the second outerframe 162 of the lower elastic member 160.

In order not only to secure a passage, through which the supportingmember 220 passes, but also to secure a space filled with siliconcapable of damping, the housing 140 may include grooves 142 a providedin the second side portions 142. For example, the groove 142 a of thehousing 140 may be filled with damping silicon.

The housing 140 may include third stoppers 149 protruding from the outersurfaces of the first side portions 141. The third stoppers 149 caninhibit the housing 140 from colliding with the inner surface of theside plate of the cover member 300 when the housing 140 moves in thesecond and third directions.

The housing 140 may further include a fourth stopper (not shown)protruding from the lower surface thereof, in order to inhibit thebottom surface of the housing 140 from colliding with the base 210, thethird coil 230 and/or the circuit board 250.

The magnets 130-1 to 130-4 are received inside the first side portions141 of the housing 140, without being limited thereto. In anotherembodiment, the magnets 130-1 to 130-4 may be disposed outside the firstside portions 141 of the housing 140.

The magnet 130 may be disposed on the first side portions 141 of thehousing 140 to correspond to or be aligned with the first coil 120 in adirection perpendicular to the optical axis direction.

For example, the magnets 130-1 to 130-4 disposed in the housing 140 mayoverlap the first coil 120 in the direction perpendicular to the opticalaxis, for example, in the second or third direction, at the initialposition of the bobbin 110. Here, the initial position of the bobbin 110may be the initial position of the AF movable portion in a state inwhich power is not applied to the first coil 120 or a position where theAF movable portion is disposed as the upper and lower elastic members150 and 160 are elastically deformed only by the weight of the AFmovable portion.

The initial position of the bobbin 110 may be a position where the AFmovable portion is disposed when gravity is applied in a direction fromthe bobbin 110 to the base 210 or when gravity is applied in a directionfrom the base 210 to the bobbin 110.

The AF movable portion may include the bobbin 110 and elements mountedin the bobbin 110.

In another embodiment, the first side portions 141 of the housing 140are not provided with the magnet seating portion 141 a, and the magnet130 may be disposed at the outside or inside of the first side portions141 of the housing 140.

The magnet 130 may have a shape corresponding to that of the first sideportions 141 of the housing 140, e.g., a rectangular parallelepipedshape, without being limited thereto.

The magnet 130 may be a unipolar magnet or a bipolar magnet having anS-pole surface opposite to the first coil 120 and an N-pole outersurface thereof. However, the embodiment is not limited thereto and theS- and N-poles are reversely disposed.

In the embodiment, the number of magnets 130 is 4, but the embodiment isnot limited thereto and the number of magnets 130 may be at least two.The surface of the magnet 130 opposite to the first coil 120 may beplanar, but the embodiment is not limited thereto and the surface of themagnet 130 opposite to the first coil 120 may be curved.

Next, the upper elastic member 150 and the lower elastic member will bedescribed.

The upper elastic member 150 and the lower elastic member 160 may becoupled with the bobbin 110 and the housing 140 to flexibly support thebobbin 110.

FIG. 7 is an assembled perspective view of the upper elastic member 150,the lower elastic member 160, the third coil 230, the circuit board 150and the base 210 of FIG. 2, and FIG. 8 is an exploded perspective viewof the third coil 230, the circuit board 250, the base 210, first andsecond position sensors 240 a and 240 b and an amplifier 310.

Referring to FIGS. 7 and 8, the upper elastic member 150 and the lowerelastic member 160 may be coupled to the bobbin 110 and the housing 140to flexibly support the bobbin 110.

For example, the upper elastic member 150 may be coupled to the upperportion, the upper surface or the upper end of the bobbin 110 and theupper portion, the upper surface or the upper end of the housing 140,and the lower elastic member 160 may be coupled to the lower portion,the lower surface or the lower end of the bobbin 110 and the lowerportion, the lower surface or the lower end of the housing 140.

At least one of the upper and lower elastic members 150 and 160 may bedivided into two or more.

For example, the upper elastic member 150 may include a plurality ofupper springs spaced apart from each other, e.g., first to fourth uppersprings 150-1 to 150-4.

The upper elastic member 150 and the lower elastic member 160 may beimplemented as a leaf spring without being limited thereto and may beimplemented as a coil spring, a suspension wire, etc.

Each of the first to fourth upper springs 150-1 to 150-4 may include aninner frame 151 coupled to the upper portion, the upper surface or theupper end of the bobbin 110, a first outer frame 152 coupled to theupper portion, the upper surface or the upper end of the housing 140,and a first frame connector 153 connecting the first inner frame 151with the first outer frame 152.

The outer frame 152 of each of the first to fourth upper springs 150-1to 150-4 may include a first coupler 510 coupled to the housing 140, asecond coupler 520 coupled to the supporting members 220-1 to 220-4 anda connector 530 connecting the first coupler 510 with the second coupler520.

The lower elastic member 160 may include a second inner frame 161coupled to the lower portion, the lower surface or the lower end of thebobbin 110, a second outer frame 162 coupled to the lower portion, thelower surface or the lower end of the housing 140 and a second frameconnector 163 connecting the second inner frame 161 with the secondouter frame 162.

Each of the first and second frame connectors 153 and 163 of the upperand lower elastic members 150 and 160 may be formed to be bent or curvedat least one time to form a predetermined pattern. Rising and fallingoperation of the bobbin 110 in the first direction may be flexibly(elastically) supported through positional change and microdeformationof the first and second frame connectors 153 and 163.

For example, one end of the first coil 120 may be bonded to the firstinner frame 151 of any one (e.g., 150-1) of the upper springs 150-1 to150-4 and the other end of the first coil 120 may be bonded to the firstinner frame 151 of another (e.g., 150-2) of the upper springs 150-1 to150-4.

In addition, for example, one end of the second coil 170 may be bondedto the first outer frame of another (e.g., 150-3) of the upper springs150-1 to 150-4, and the other end of the second coil 170 may be bondedto the first outer frame of another (e.g., 150-4) of the upper springs150-1 to 150-4.

For example, the first connector connected to the first coil 120 may beprovided on the first inner frame 151 of each of the first to secondupper springs 150-1 to 150-2 by soldering or a conductive adhesivemember, and the second connector connected to the first coil 120 may beprovided on the first outer frame 152 of each of the third to fourthupper springs 150-3 to 150-4 by soldering or a conductive adhesivemember.

Each of the first to fourth upper springs 150-1 to 150-4 may include athrough-hole 151 a disposed in the first inner frame 151 and engagedwith the first upper supporting projection 113 of the bobbin 110 and athrough-hole 152 a disposed in the first outer frame 152 and engagedwith the second upper supporting projection 144 of the housing 140.

In addition, the lower elastic member 160 may include a through-hole 161a disposed in the second inner frame 161 and engaged with the firstlower supporting projection 117 of the bobbin 110 and a through-hole 162a disposed in the second outer frame 162 and engaged with the secondlower supporting projection 147 of the housing 140.

In order to absorb and damp vibration of the bobbin 110, the lens movingapparatus 100 may further include a first damping member (not shown)disposed between each of the upper springs 150-1 to 150-4 and thehousing 140.

For example, the first damping member (not shown) may be disposed in aspace between the first frame connector 153 of each of the upper springs150-1 to 150-4 and the housing 140.

In addition, for example, the lens moving apparatus 100 may furtherinclude a second damping member (not shown) disposed between the secondframe connector 163 of the lower elastic member 160 and the housing 140.

In addition, for example, a damping member (not shown) may be furtherdisposed between the inner surface of the housing 140 and the outercircumferential surface of the bobbin 110.

Next, the second coil 170 will be described.

The second coil 170 may be disposed on the upper surface of the housing140 or the side portions of the housing 140.

For example, the second coil 170 may be disposed at the upper side ofthe side portions of the housing 140. The second coil 170 may bereferred to as a sensing coil.

The second coil 170 may have a closed loop shape wound to rotateclockwise or counterclockwise about an optical axis, e.g., a ring shape.For example, the second coil 170 may have a ring shape to surround theouter surfaces of the first and second side portions 141 and 142 of thehousing 140 clockwise or counterclockwise about the optical axis.

The second coil 170 may be located below the upper elastic member 150and may be located above the magnet 130.

At the initial position of the AF movable portion, the second coil 170may not overlap the magnet 130 in the direction perpendicular to theoptical axis direction, thereby reducing mutual interference between themagnet 130 and the sensing coil 170.

At the initial position of the AF movable portion, the second coil 170may be located to be spaced apart from the first coil 120 by apredetermined distance in the optical axis direction, and may notoverlap the first coil 120 in the direction perpendicular to the opticalaxis direction. When the predetermined distance between the first coil120 and the second coil 170 in the optical axis direction is maintained,it is possible to ensure linearity of the voltage induced in the secondcoil 170 by current of the first coil 120.

At the initial position of the AF movable portion, the second coil 170may overlap the magnet 130 in the optical axis direction, without beinglimited thereto. In another embodiment, the second coil 170 may notoverlap the magnet 130 in the optical axis direction.

The second coil 170 may be disposed on the outer surfaces of the sideportions of the housing 140 such that at least a portion thereof islocated outside the supporting member 220. For example, the outside ofthe supporting member 220 may be opposite to the center of thehollowness of the housing 140 with respect to the supporting member 220.

The second coil 170 may be a sensing coil (e.g., an AF sensing coil) forsensing the position or displacement of the AF movable portion, e.g.,the bobbin 110. For example, the second coil 170 may be implemented inthe form of an FPCB or fine pattern (FP) coil.

For example, when the AF movable portion moves by interaction betweenthe first coil 120, to which the driving signal is provided, and themagnet 130, an induced voltage may be generated in the second coil 170by interaction with the first coil 120. The level of the induced voltageof the second coil 170 may be changed according to displacement of theAF movable portion. By detecting the level of the induced voltagegenerated in the second coil 170, it is possible to detect displacementof the AF movable portion.

FIG. 13 is a view showing mutual inductance according to a distancebetween the first coil 120 and the second coil 170. An X-axis representsmovement displacement of an AF movable portion.

Referring to FIG. 13, as the distance between the first coil 120 and thesecond coil 170 decreases, mutual inductance between the first coil 120and the second coil 170 may increase and the voltage induced in thesecond coil 170 may increase.

In contrast, as the distance between the first coil 120 and the secondcoil 170 increases, mutual inductance between the first coil 120 and thesecond coil 170 may decrease and the voltage induced in the second coil170 may decrease.

Based on the level of the induced voltage generated in the second coil170, displacement of the AF movable portion may be detected.

In general, for auto focus (AF) feedback control, since the AF movableportion, e.g., a position sensor for detecting displacement of thebobbin and a separate power connection structure for driving theposition sensor are necessary, the price of the lens driving unit mayincrease and a difficulty in manufacturing process may occur.

In addition, a linear region (hereinafter referred to as a first linearregion) of the graph showing the movement distance of the bobbin and themagnetic flux of the magnet detected by the position sensor may belimited by the positional relationship between the magnet and theposition sensor.

In the embodiment, since a separate position sensor for detectingdisplacement of the bobbin 110 is not necessary, it is possible toreduce the cost of the lens moving apparatus and to improve the ease ofthe manufacturing process.

In addition, since mutual induction between the first coil 120 and thesecond coil 170 is used, the linear section of the graph between themovement distance of the bobbin 110 and the induced voltage of thesecond coil 170 may increase as compared to the first linear section.Therefore, the embodiment can secure a wide range of linearity, improvea process failure rate, and perform more accurate AF feedback control.

Next, the base 210, the third coil 230, the position sensor 240, thecircuit board 250 and the amplifier 310 will be described.

The base 210 may be coupled with the cover member 300 to form areception space between the bobbin 110 and the housing 140. The base 210may include a hollowness corresponding to the hollowness of the bobbin110 and/or the hollowness of the housing 140, and have a shape matchingor corresponding to that of the cover member 300, e.g., a rectangularshape.

The base 210 may be located below the bobbin 110 and the housing 140,and may have a supporting groove or a supporting portion formed in asurface opposite to a portion on which a terminal surface 253 of thecircuit board 250 is formed.

In order to avoid spatial interference with the supporting members 220-1to 220-4, the corners of the base 210 may have grooves 212.

If the corners of the cover member 300 have a protruding shape, theprotrusions of the cover member 300 may be coupled to the base 210through the grooves 212.

The base 210 may include position sensor seating grooves 215-1 and 215-2recessed from the upper surface thereof and having the position sensors240 a and 240 b disposed therein.

In addition, a groove 215-3 in which the amplifier 310 is disposed maybe provided in the upper surface of the base 210. For example, for easeof connection with the terminals 251, the groove 215-3 may be located inone area of the upper surface of the base 210 adjacent to the terminalsurface 253 of the circuit board 250.

For example, the position sensor seating grooves 215-1 and 215-2 and thegroove 215-3 may be disposed adjacent to different sides of the sides ofthe upper surface of the base 210.

The first and second position sensors 240 a and 240 b may be disposed inthe position sensor seating grooves 215 a and 215 b of the base 210located below the circuit board 250 and may be electrically connected tothe circuit board 250. For example, the first and second positionsensors 240 a and 240 b may be mounted on the back surface of thecircuit board.

For example, each of the first and second position sensors 215 a and 215b may receive the driving signal from the circuit board 250 and anoutput signal of each of the first and second position sensors 215 a and215 b may be output to the circuit board 250.

The first and second position sensors 240 a and 240 b may detectdisplacement of the housing 140 relative to the base 210 in thedirection (e.g., X-axis or Y-axis) perpendicular to the optical axis(e.g., Z-axis). For example, when the housing 140 moves in the seconddirection and/or the third direction, the first and second positionsensors 240 a and 240 b may detect change in magnetic force emitted fromthe magnet 130 and output a signal according to the result of detection.

For example, the first and second position sensors 240 a and 240 b maybe implemented as a Hall sensor alone or a driver including a Hallsensor. This is merely an example and any sensor capable of detecting aposition in addition to magnetic force may be used. The first and secondposition sensors 240 a and 240 b may also be referred to as opticalimage stabilizer (OIS) position sensors.

The third coil 230 may be disposed at the upper side of the circuitboard 250 and the first and second position sensors 240 a and 240 b andthe amplifier 310 may be disposed at the lower side of the circuit board250.

The circuit board 250 may be disposed on the upper surface of the base210, and may include hollowness corresponding to the hollowness of thebobbin 110, the hollowness of the housing 140 and/or the hollowness ofthe base 210.

The circuit board 250 may include at least one terminal surface 253 bentfrom the upper surface thereof and a plurality of terminals 251 providedon the terminal surface 253. For example, the circuit board 250 may havethe terminals provided on any two opposite sides of the upper surfacethereof, without being limited thereto.

For example, the circuit board 250 may include first terminalselectrically connected to the supporting members 221-1 to 220-4electrically connected to the first coil 120 and the second coil 170,second terminals electrically connected to the third coils 230-1 to230-4, and third terminals electrically connected to the amplifier 310.

The circuit board 250 may be a flexible printed circuit board (FPCB)without being limited thereto and the terminal of the circuit board 250may be configured on the surface of the base 210 or a PCB using asurface electrode method.

The circuit board 250 may include through-holes 250 a, through which thesupporting members 220-1 to 220-4 pass. The supporting members 220-1 to220-4 may be electrically connected to the lower surface (or a circuitpattern formed on the lower surface) of the circuit board 250 throughthe through-holes of the circuit board 250 using soldering.

In addition, in another embodiment, the circuit board 250 may notinclude the through-holes 250 a, and the supporting members 220-1 to220-4 may be electrically connected to the circuit pattern or the padformed on the upper surface of the circuit board 250 through soldering.

A projection (not shown) for coupling with the circuit board 250 may beprovided on the upper surface of the base 210, and the circuit board 250may include a through-hole (not shown) engaged with and fixed to theprojection of the base 210 through thermal fusion or an adhesive member.

The third coil 230 may be disposed on the upper surface of the circuitboard 250 to correspond to or to be aligned with the magnet 130. Thenumber of third coil 230 may be one or more and may be equal to thenumber of magnets 130, without being limited thereto.

For example, the third coil 230 may include a plurality of OIS coils230-1 to 230-4 formed in a circuit member 231 or the board separatelyfrom the circuit board 250 without being limited thereto. In anotherembodiment, the OIS coils 230-1 to 230-4 may be spaced apart from eachother on the circuit board 250 without a separate circuit member or aboard.

The OIS coils 230-1 to 230-4 may be electrically connected to thecircuit board 250, e.g., the terminals of the circuit board 250. Thedriving signal, e.g., driving current, may be provided to each of theOIS coils 230-1 to 230-4.

By electromagnetic force caused by interaction between the magnets 130opposite to or aligned with each other and the OIS coils 230-1 to 230-4,to which the driving signal is provided, the housing 140 may move in thesecond direction and/or the third direction, and movement of the housing140 may be controlled, thereby performing handshake correction.

By soldering or the conductive adhesive member, one end of thesupporting member 220 may be coupled to the upper elastic member 150,and the other end of the supporting member 220 may be coupled to thecircuit board 250, the circuit member 231 and/or the base 210.

A plurality of supporting members 220 may be provided and the pluralityof supporting members 220-1 to 220-4 may be located to correspond to thesecond side portions 142 of the housing 140 to support the bobbin 110and the housing 140 such that the bobbin 110 and the housing 140 move inthe direction perpendicular to the first direction.

For example, each of the plurality of supporting members 220-1 to 220-4may be disposed adjacent to any one of four second side portions 142.For example, the supporting members 220-1 to 220-4 may be located insidethe second coil 170 having a ring shape.

Although one supporting member is disposed on each of the second sideportions 142 of the housing 140 in FIG. 7, the embodiment is not limitedthereto.

In another embodiment, two or more supporting members may be disposed onat least one of the second side portions 142 of the housing 140, and theupper elastic member 150 may include two or more upper springs separatedand spaced apart from each other on at least one of the second sideportions of the housing 140. For example, two supporting membersdisposed on any one of the second side portions of the housing 140 maybe connected to any one of the two upper springs separated from eachother on the second side portion.

One end of each of the supporting members 220-1 to 220-4 may be bondedto the outer frame 152 of the upper springs 150-1 to 150-4 disposed onthe corresponding second side portion. The plurality of supportingmembers 220-1 to 220-4 may be spaced apart from the housing 140, and maynot be fixed to the housing 140 but may be directly connected to theconnector 530 of the outer frame 153 of the upper springs 150-1 to150-4.

In another embodiment, the supporting member 220 may be disposed on thefirst side portions of the housing 140 in the form of a leaf spring.

The plurality of supporting members 220-1 to 220-4 and the upper springs150-1 to 150-4 may transmit the driving signals from the circuit board250 to the first coil 120, and the induced voltage output from thesecond coil 170 may be transmitted to the circuit board 250.

The plurality of supporting members 220-1 to 220-4 may be formedseparately from the upper elastic member 150, and may be implemented asan elastically supportable member, e.g., a leaf spring, a coil spring ora suspension wire. In addition, in another embodiment, the supportingmembers 220-1 to 220-4 may be formed integrally with the upper elasticmember 150.

FIG. 9a is a view showing the first and second position sensors 240 aand 240 b and the amplifier 310 mounted on the circuit board 250.

Referring to FIG. 9a , the first and second position sensors 240 a and240 b and the amplifier 310 may be disposed on the first surface of thecircuit board 250.

For example, the first surface of the circuit board 250 may be the lowersurface of the circuit board 250 opposite to the upper surface of thebase 210.

For example, each of the first and second position sensors 240 a and 240b may be bonded to the lower surface of the circuit board 250 and may beelectrically connected to at least one of the terminals of the circuitboard 250.

For example, the amplifier 310 may be bonded to the lower surface of thecircuit board 250 and may be electrically connected to at least anotherof the terminals of the circuit board 250.

The amplifier 310 may be formed in the form of a chip or an integratedcircuit (IC), without being limited thereto.

FIG. 9b is a view showing an conductible connection relationship betweenthe second coil 170 and the amplifier 310.

Referring to FIG. 9b , the amplifier 310 includes a first input terminal312, a second input terminal 314, an output terminal 316, and first andsecond power terminals 317 and 318.

A first power supply voltage VDD and a second power supply voltage VSSfor amplification operation are provided to the first and second powerterminals 317 and 318 of the amplifier 310. The first power supplyvoltage VDD may be provided to the first power terminal 317 and thesecond power supply voltage VSS may be provided to the second powerterminal 318.

For example, the second power supply voltage VSS may be less than thefirst power supply voltage VDD. For example, the first power supplyvoltage VDD may be a positive voltage or may be connected to a positivevoltage or the second power supply voltage VSS may be a negative voltageor may be connected to a negative voltage, without being limitedthereto.

For example, the first power supply voltage VDD may be a positivevoltage and the second power supply voltage VSS may be the ground or 0V.

The amplifier 310 amplifies the output signal V1 of the second coil 170received through the first and second input terminals 312 and 314 andoutputs an amplified signal AV1 according to the result ofamplification. The amplified signal AV1 may be output to at least one ofthe terminals of the circuit board 250.

For example, one end of the second coil 170 may be connected to thefirst input terminal 312 of the amplifier 310, and the other end of thesecond coil 170 may be connected to the second input terminal 314 of theamplifier 310.

When the driving signal Id1 is provided to the first coil 120, theinduced voltage V1 may be generated in the second coil 170, and theamplifier 310 may receive the induced voltage of the second coil 170through the first and second input terminals 312 and 314, amplify thereceived induced voltage V1 and output an amplified signal V2 throughthe output terminal 316.

FIG. 12 is a view showing the driving signal Id1 of the first coil 120,the induced voltage V1 of the second coil 170 and the amplified signalAV1 of the amplifier 310.

Referring to FIG. 12, the driving signal Id1 of the first coil 120 maybe a pulse signal, e.g., a pulse width modulation (PWM) signal.

The induced voltage V1 may be generated in the second coil 170, byinteraction with the first coil 120, to which the driving signal ID1 isprovided.

The induced voltage V1 may include noise caused by a pattern and noisecaused by an external environment (e.g., an external voltage). Suchnoise may cause errors in detection of displacement of the AF movableportion and reduce accuracy of the AF operation. For example, the noisecaused by the pattern may include noise caused by the pattern of thesecond coil 170 or noise caused by the wire of the circuit board 250,without being limited thereto.

As shown in FIG. 12, the induced voltage V1 may include ripple caused bynoise.

The amplifier 310 may amplify the induced voltage V1 with predeterminedgain and output an amplified signal AV1 according to the result ofamplification. For example, the predetermined gain may be 2× or 30×,without being limited thereto.

For example, the amplifier 310 may be a differential amplifier. Forexample, the first input terminal 312 of the amplifier 310 may be apositive (+) input terminal and the second input terminal 314 of theamplifier 310 may be a negative (−) input terminal.

For example, although the amplifier 310 is a differential amplifier, theembodiment is not limited thereto.

The level of the amplified signal AV1 of the amplifier 310 may beincreased as compared to the induced signal V1, and ripple caused by thenoise may be reduced. Therefore, upon comparison with thesignal-to-noise ratio (SNR) of the induced voltage V1, the SNR of theamplified signal AV1 of amplifier 310 may be improved and influence ofnoise may be reduced.

FIG. 10 is a view showing conductible connection between supportingmembers 220-1 to 220-4 and the amplifier 310 and conductible connectionbetween the amplifier 310 and terminals 251-1 to 251-5 of the circuitboard 250.

Referring to FIG. 10, each of the supporting members 220-1 to 220-4 maybe bonded to any one adjacent area of the corners 10 a to 10 d of thelower surface of the circuit board 250 by penetrating through thecircuit board 250. One end of each of the supporting members 220-1 to220-4 may be bonded to any one of the pads 220 a to 220 d providedadjacent to the corners of the lower surface of the circuit board 250.

The first and second input terminals 312 and 314 of the amplifier 310may be electrically connected to the supporting members (e.g., 220-3 and220-4) electrically connected to the second coil 170.

For example, the first and second input terminals 312 and 314 of theamplifier 310 may be electrically connected to the first and second pads220 a and 220 b of the circuit board 250, to which the supportingmembers (e.g., 220-3 and 220-4) electrically connected to the secondcoil 170 are bonded.

For example, the circuit board 250 may include a first wire 30-1connecting the first input terminal 312 of the amplifier 310 with thefirst pad 220 a of the circuit board 250 and second wires 30-1 and 30-2connecting the second input terminal 314 of the amplifier 310 with thesecond pad 220 b of the circuit board 250. The first wire 30-1 and thesecond wire 30-2 may have a straight-line shape without being limitedthereto. In another embodiment, the first wire 30-1 and the second wire30-2 may have a straight-line shape and/or a curved shape.

For example, the amplifier 310 may be disposed between the first andsecond pads 220 a and 220 b of the circuit board 250, and may bedisposed on the lower surface of the circuit board 250 adjacent to theterminal surface 253 on which the terminals 251-1 to 251-5 are provided.

For example, the amplifier 310 may be disposed on the center of one areaof the lower surface of the circuit board 250 located between the firstand second pads 220 a and 220 b. For example, the distance between theamplifier 310 and the first pad 220 a may be equal to the distancebetween the amplifier 310 and the second pad 220 b.

In addition, for example, the length of the first wire 30-1 may be equalto that of the second wire 30-2. By making the length of the first wire30-1 and the length of the second wire 30-2 equal, influence of noise bythe wires 30-1 and 30-2 on the induced voltage of the second coil 170may be reduced. For example, as the amplifier 310 differentiallyamplifies the induced voltage V1 input through the first wire 30-1 andthe second wire 30-2, it is possible to reduce influence of noise.

The output terminal 316 of the amplifier 310 may be electricallyconnected to the first terminal 251-1 of the circuit board 250 throughthe third wire 30-3 provided on the circuit board 250.

In addition, the first power terminal 317 of the amplifier 310 and thesecond terminal 251-2 of the circuit board 250 may be electricallyconnected through the fourth wire 30-4 provided on the circuit board250, and the second power terminal 318 of the amplifier 310 and thethird terminal 251-3 of the circuit board 250 may be electricallyconnected through the fifth wire 30-5 provided on the circuit board 250.

The first terminal 251-1 of the circuit board 250 may be disposedbetween the second terminal 251-2 and the third terminal 251-3.

The circuit board 250 may include a first dummy terminal 251-4 disposedbetween the first terminal 251-1 and the second terminal 251-2 and asecond dummy terminal 251-5 disposed between the first terminal 251-1and the third terminal 251-3.

The first to third terminals 251-1 to 251-3 and the first and seconddummy terminals 251-4 and 251-5 of the circuit board 250 may be arrangedon the terminal surface 253 in a row in the direction perpendicular tothe optical axis, e.g., in the X-axis or Y-axis direction.

The first and second dummy terminals 251-4 and 251-5 may be electricallydisconnected from the first to third terminals 251-1 to 251-3. The firstand second dummy terminals 251-4 and 251-5 may separate the firstterminal 251-1 from the second and third terminals 251-2 and 251-3 andreduce influence of the voltages VDD and VSS input through the first andsecond terminals 251-2 and 251-3 on the amplified signal AV1 output fromthe first terminal 251-1.

That is, the first and second dummy terminals 251-4 and 251-5 maysuppress noise generated in the amplified signal AV1 output from thefirst terminal 251-1 by the voltages VDD and VSS input through the firstand second terminals 251-2 and 251-3.

Although one dummy terminal is disposed between the first terminal 251-1and the second terminal 251-2 and between the first terminal 251-1 andthe third terminal 251-3 in FIG. 10, the embodiment is not limitedthereto.

In another embodiment, two or more dummy terminals may be disposedbetween the first terminal 251-1 and the second terminal 251-2 andbetween the first terminal 251-1 and the third terminal 251-3.

FIG. 14a is a view showing arrangement of first to third terminals251-1′ to 251-3′ according to another embodiment.

Referring to FIG. 14a , the first terminal 251-1 may be electricallyconnected to the output terminal 316 of the amplifier 310, the secondterminal 251-2′ may be electrically connected to the first powerterminal 317 of the amplifier 310, e.g., (+) power terminal, and thethird terminal 251-3′ may be electrically connected to the second powerterminal 318 of the amplifier 310, e.g., (−) power terminal or theground.

The second and third terminals 251-2′ and 251-3′ may be disposed on oneside of the first terminal 251-2′ and dummy terminals may not bedisposed between the first to third terminals 251-1′ to 251-3′. Thethird terminal 251-3′ may be disposed between the first terminal 251-1′and the second terminal 251-2′.

By separating the first terminal 251-1′ and the second terminal 251-2′from each other by the third terminal 251-3′, it is possible to inhibitnoise caused by the voltage VDD provided to the second terminal 251-2′from being generated in the amplified signal AV1 of the amplifier 310output through the first terminal 251-1′.

FIG. 14b is a view showing arrangement of first to third terminals251-1″ to 215-3″ and a dummy terminal 251-4″ according to anotherembodiment.

Referring to FIG. 14b , the first terminal 251-1″ may correspond to thefirst terminal 251-1′ of FIG. 14a , the second terminal 251-2″ maycorrespond to the second terminal 251-2′ of FIG. 14a , the thirdterminal 251-3″ may correspond to the third terminal 251-3′ of FIG. 14a, and the description of FIG. 14a is applicable thereto.

The dummy terminal 251-4″ may be disposed between the first terminal251-1″ and the third terminal 251-3″. The dummy terminal 251-4″ mayserve to inhibit noise from being generated in the amplified signal AV1output from the first terminal 251-1″ by the voltages VDD and VSS inputthrough the first and second terminals 251-2 and 251-3.

FIG. 11 is a view showing conductible connection between the supportingmembers 220-1 to 220-4 and the amplifier 310 and conductible connectionbetween the amplifier 310 and terminals 251-1 to 251-5 of the circuitboard 250 according to another embodiment.

Referring to FIG. 11, two upper springs electrically connected to bothends of the second coil 170 may be disposed at the first corner of thecorners of the housing 140. The two pads 220 a-1 and 220-a-2 may bedisposed adjacent to the second corner of the lower surface of thecircuit board 250 corresponding to the first corner.

For example, two supporting members may be disposed on at least one ofthe second side portions of the housing 140 and two upper springselectrically connected to both ends of the second coil 170 may bedisposed on at least one of the second side portions of the housing 140.

Two upper springs electrically connected to both ends of the second coil170 may be electrically connected to two supporting members disposed onany one of the second side portions of the housing 140. The twosupporting members electrically connected to the second coil 170 may bebonded to an area adjacent to any one of the corners 10 a to 10 d of thelower surface of the circuit board 250 by penetrating through thecircuit board 250.

One end of each of two supporting members electrically connected to thesecond coil 170 may be bonded two pads 220 a-1 and 220 a-2 providedadjacent to the corner of the lower surface of the circuit board 250.

The first and second input terminals 312 and 314 of the amplifier 310may be electrically connected to the first and second pads 220 a-1 and220 a-2 of the circuit board 250.

For example, the circuit board 250 may include a first wire 40-1connecting the first input terminal 312 of the amplifier 310 with thefirst pad 220 a-1 of the circuit board 250 and a second wire 40-2connecting the second input terminal 314 of the amplifier 310 with thesecond pad 220 a-2 of the circuit board 250.

The amplifier 310 may be disposed adjacent to any one corner of thelower surface of the circuit board 250, on which the first and secondpads 220 a-1 and 220 a-2 of the circuit board 250 are provided.

Since the amplifier 310 and the first and second pads 220 a-1 and 220a-2 are disposed adjacent to any one corner of the circuit board 250, itis possible to reduce the lengths of the first wire 40-1 and the secondwire 40-2 and to reduce noise generated in the amplified signal AV1 dueto the wires 40-1 and 40-2.

As shown in FIG. 11, the output terminal 316 of the amplifier 310 andthe first and second power terminals 317 and 318 may be electricallyconnected to the first to third terminals 251-1 to 251-3 of the circuitboard 250 through the third to fifth wires 40-3 to 40-5 provided on thecircuit board 250.

The circuit board 250 may include dummy terminals 251-4 and 251-5disposed between the first terminal 251-1 and the second terminal 251-2and between the first terminal 251-1 and the third terminal 251-3.

Meanwhile, the lens moving apparatus according to the above-describedembodiment may be used in various fields such as camera modules oroptical instruments.

FIG. 15a is an exploded perspective view of a camera module 200according to an embodiment, and FIG. 15b is a block diagram showingamplification of the induced voltage of the second coil by the amplifier310 of the lens moving apparatus 100 and an amplifier 320 of a cameramodule 200.

Referring to FIG. 15a , the camera module 200 may include a lens barrel400, a lens moving apparatus 100, an adhesive member 612, a filter 610,a first holder 600, a second holder 800, an image sensor 810, a motionsensor 820, a controller 830 and a connector 840.

The lens barrel 400 may be mounted in the bobbin 110 of the lens movingapparatus 100. In another embodiment, a lens may be directly mounted inthe bobbin 110.

The first holder 600 may be disposed under the base 210 of the lensmoving apparatus 100. The filter 610 may be mounted in the first holder600, and the first holder 600 may include a protrusion 500 in which thefilter 610 is seated.

The adhesive member 612 may couple or adhere the base 210 of the lensmoving apparatus 100 to the first holder 600. The adhesive member 612may serve to inhibit foreign materials from flowing into the lens movingapparatus 100 in addition to the above-described adhesive function. Forexample, the adhesive member 612 may be epoxy, a thermohardeningadhesive or an ultraviolet hardening adhesive, etc.

The filter 610 may serve to block light in a specific frequency band oflight passing through the lens or the lens barrel 400 from being inputto the image sensor 810. The filter 610 may be an infrared ray (IR) cutfilter, without being limited thereto. At this time, the filter 610 maybe disposed to be parallel to the x-y plane.

A hollowness may be formed in a portion of the first holder 600 in whichthe filter 610 is mounted, such that light passing through the filter610 is input to the image sensor 810.

The second holder 800 may be disposed below the first holder 600 and theimage sensor 810 may be installed in the second holder 800. The imagesensor 810 may be a portion in which an image included in light isformed by receiving light passing through the filter 610.

The second holder 800 may include various circuits or elements in orderto convert the image formed by the image sensor 810 into an electricalsignal and transmit the electrical signal to an external device.

The second holder 800 may have the image sensor installed therein, havea circuit pattern formed thereon, and may be implemented as a circuitboard on which various elements may be coupled, such as a PCB or anFPCB.

The image sensor 810 may receive the image included in the light inputthrough the lens moving apparatus 100 and convert the received imageinto an electrical signal.

The filter 610 and the image sensor 810 may be disposed to be spacedapart from and opposite to each other in a first direction.

The motion sensor 820 may be installed in the second holder 800, and maybe electrically connected to the controller 830 through the wires or thecircuit pattern provided on the second holder 800.

The motion sensor 820 outputs rotation angular speed information bymovement of the camera module 200. The motion sensor 820 may beimplemented as a 2-axis or 3-axis gyro sensor or an angular speedsensor. The motion sensor 820 may be configured separately from thecontroller 830 without being limited thereto. In another embodiment, themotion sensor may be configured to be included in the controller 830.

The controller 830 may be mounted on the second holder 800 and may beelectrically connected to the first coil 120, the second coil 170, andthe third coil 230, the first and second position sensors 240 a and 240b, and the amplifier 310 of the lens moving apparatus 100.

For example, the second holder 800 may be electrically connected to thecircuit board 250 of the lens moving apparatus 100, the controller 820mounted on the second holder 800 may be electrically connected to thefirst coil 120, the second coil 170, the third coil 230, the first andsecond position sensors 240 a and 240 b, and the amplifier 310 throughthe terminals 251 of the circuit board 250.

For example, the controller 830 may include an AF driver, an OIS driver,first and second drivers, first to third amplifiers and a servocontroller.

The AF driver may provide a first driving signal for driving the firstcoil 120.

The OIS driver may provide a second driving signal for driving the thirdcoils 230-1 to 230-4.

The first driver may provide a third driving signal for driving a firstposition sensor 240 a and the second driver may provide a fourth drivingsignal for driving a second position sensor 240 b.

The first amplifier 320 (see FIG. 15a ) may amplify an amplified signalAV1 of the amplifier 310 and output the amplified signal according tothe result of amplification. The second amplifier may amplify the outputsignal of the first position sensor 240 a and output an amplified signalaccording to the result of amplification. The third amplifier mayamplify the output signal of the second position sensor 240 b and outputthe amplified signal according to the result of amplification.

Referring to FIG. 15b , the induced voltage V1 of the second coil 170may be primarily amplified by the amplifier 310 and thus the lens movingapparatus 100 may output the first amplified signal AV1 having animproved SNR.

The camera module 200 may receive the first amplified signal AV1 havingthe improved SNR from the lens moving apparatus 100, and the firstamplifier 320 may secondarily amplify the first amplified signal AV1 bypredetermined gain A and output a second amplified signal AV2.

The gain of the first amplifier 200 of the camera module 200 may begreater than that of the amplifier 310 of the lens moving apparatus 100.For example, the amplification factor of the amplifier 310 of the lensmoving apparatus 100 may be less than that of the first amplifier 320 ofthe camera module 200.

Since the camera module 200 receives the first amplified signal AV1having the improved SNR from the lens moving apparatus 100 and amplifiesthe received first amplified signal, it is possible to reduce influenceof noise generated in the lens moving apparatus 100. Therefore, theembodiment can improve accuracy of AF operation.

The servo controller may output a first control signal for controllingthe AF driver based on the amplified signal AV2 of the first amplifier320 and the rotation angular speed information received from the motionsensor 820 and perform AF feedback operation through the first controlsignal.

In addition, the servo controller may output a second control signal forcontrolling the OIS driver based on the amplified signals of the secondand third amplifiers and the rotation angular speed information receivedfrom the motion sensor 820 and perform OIS feedback operation throughthe second control signal.

The connector 840 may be electrically connected to the second holder800, and may include a port for conductible connection with an externaldevice.

FIG. 16 is an exploded perspective view of a lens moving apparatus 1100according to another embodiment, and FIG. 17 is an assembled perspectiveview of the lens moving apparatus 1100 of FIG. 16 except for a cover1300.

Referring to FIGS. 16 and 17, the lens moving apparatus 1100 includes abobbin 1110, a first coil 1120, a magnet 1130, a housing 1140, an upperelastic member 1150, a lower elastic member 1160, a first sensing coil1171, a sensing coil 1172, a supporting member 1220, a third coil 1230,a circuit board 1250, position sensors 1240 and a detector 1241. Thelens moving apparatus 100 may further include a cover member 1300 and abase 1210.

The first sensing coil 1171 may be referred to as a second coil, thesecond sensing coil 1172 may be referred to as a third coil, and thethird coil 1230 may be referred to as a fourth coil.

The cover member 1300 receives the other elements 1110, 1120, 1130,1140, 1150, 1160 and 1250 in a reception space formed together with thebase 1210.

The cover member 1300 may be a box having an open lower portion andincluding an upper plate and side plates, a lower portion of the covermember 1300 may be coupled with an upper portion of the base 1210. Theshape of an upper end of the cover member 300 may be polygonal, forexample, rectangular or octagonal.

The cover member 1300 may include a hollowness formed in the upper endthereof to expose a lens (not shown) coupled to the bobbin 1110. Inaddition, a window made of a light transmissive material may be furtherprovided in the hollowness of the cover member 1300 in order to inhibitforeign materials such as dust or moisture from permeating into thecamera module.

The cover member 1300 may be made of a nonmagnetic material such as SUSin order to inhibit the cover member from being adhered to the magnet1130 or may be made of a magnetic material to function as a yoke.

The bobbin 1110 may be disposed inside the housing 1140, and may move inan optical-axis (OA) direction or a first direction (e.g., a Z-axisdirection) by electromagnetic interaction between the first coil 1120and the magnet 130.

A lens may be directly installed in the bobbin 1110, without beinglimited thereto. In another embodiment, the bobbin 1110 may include alens barrel (not shown) in which at least one lens is installed, and thelens barrel may be coupled to the inside of the bobbin 1110 usingvarious methods.

The bobbin 1110 may have a hollowness in which the lens or the lensbarrel will be installed. The shape of the hollowness of the bobbin 1110may be equal to the shape of the lens or the lens barrel and may be, forexample, circular, elliptical or polygonal, without being limitedthereto.

FIG. 18a is a first perspective view of the bobbin 1110 shown in FIG.16, and FIG. 18b is a second perspective view of the bobbin 1110 shownin FIG. 16.

Referring to FIGS. 18a and 18b , the bobbin 1110 may include a firstprotrusion 1111 protruding from an upper surface of the bobbin 1110 in afirst direction and a second protrusion 1112 protruding from an outercircumferential surface of the bobbin 110 in a second direction and/or athird direction.

The first protrusion 1111 of the bobbin 1110 may include a guide portion1111 a and a first stopper 1111 b. The guide portion 1111 a of thebobbin 1110 serves to guide the installation position of the upperelastic member 1150. For example, the guide portion 111 a of the bobbin1110 may guide a first frame connector 1153 of the upper elastic member1150.

The second protrusion 1112 of the bobbin 1110 may protrude from theouter circumferential surface of the bobbin 1110 in the second directionand/or the third direction perpendicular to the first direction. Inaddition, a first engagement projection 1113 a engaged with athrough-hole 1151 a of a first inner frame 1151 of the upper elasticmember 1150 may be provided on an upper surface 1112 a of the secondprotrusion 1112 of the bobbin 1110.

The first stopper 1111 b of the first protrusion 111 and the secondprotrusion 1112 of the bobbin 1110 may serve to inhibit the uppersurface of the bobbin 1110 from directly colliding with the inside ofthe cover member 1300 even when the bobbin 1110 moves beyond aprescribed range by external impact while the bobbin 1110 moves in thefirst direction for the autofocus function.

The bobbin 1110 may include a second engagement projection 1117 engagedwith and fixed to the through-hole 1161 a of the lower elastic member1160.

The bobbin 1110 may include a second stopper 1116 protruding from thelower surface thereof.

The second stopper 1116 of the bobbin 1110 may serve to inhibit thelower surface of the bobbin 1110 from directly colliding with the base1210, the third coil 1230 or the circuit board 1250 even when the bobbin1110 moves beyond a prescribed range by external impact while the bobbin1110 moves in the first direction for the autofocus function.

The outer circumferential surface 1110 b of the bobbin 1110 may includefirst side portions 1110 b-1 and second side portions 1110 b-2 locatedbetween the first side portions 1110 b-1.

The first side portions 1110 b-1 of the bobbin 1110 may correspond to orbe opposite to the magnet 1130 and may correspond to or be opposite tothe first side portions 1141 of the housing 1140.

Each of the second side portions 1110 b-2 of the bobbin 1110 may bedisposed between two adjacent first side portions. The outercircumferential surface of each of the first side portions 1110 b-1 ofthe bobbin 1110 may be planar. The outer circumferential surface of eachof the second side portions 1110 b-2 of the bobbin 1110 may be curved,without being limited thereto. In another embodiment, the outercircumferential surface of each of the second side portions 1110 b-2 ofthe bobbin 1110 may be planar.

A groove 1105 in which the first coil 1120 will be seated or disposedmay be provided in the outer circumferential surface of the bobbin 1110.For example, the groove 1105 may be provided in the outer surfaces ofthe first and second side portions 1110 b-1 and 1110 b-2 of the bobbin1110.

The first coil 1120 is disposed on the outer circumferential surface1110 b of the bobbin 1110.

The first coil 1120 may be an AF driving coil for performingelectromagnetic interaction with the magnet 1130 disposed in the housing1140.

In order to generate electromagnetic force by electromagneticinteraction with the magnet 1130, a driving signal (e.g., drivingcurrent or voltage) may be applied to the first coil 1120.

By electromagnetic force due to interaction between the first coil 1120and the magnet 1130, an AF movable portion may move in the firstdirection. By controlling the driving signal applied to the first coil1120 to control electromagnetic force, it is possible to controlmovement of the AF movable portion in the first direction and thus toperform an autofocus function.

The AF movable portion may include the bobbin 1110 elastically supportedby upper and lower elastic members 1150 and 1160 and elements installedin the bobbin 1110 to move along with the bobbin 1110. For example, theAF movable portion may include the bobbin 1110, the first coil 1120, anda lens (not shown) installed in the bobbin 1110.

For example, the first coil 1120 may be wound to surround the outercircumferential surface of the bobbin 1110 to rotate about an opticalaxis (OA) in a clockwise or counterclockwise direction. In anotherembodiment, the first coil 1120 may be implemented in a coil ring shapewound clockwise or counterclockwise about an axis perpendicular to theoptical axis OA, and the number of coil rings may be equal to the numberof magnets 1130, without being limited thereto.

The first coil 1120 may be electrically connected to at least one of theupper or lower elastic members 1150 or 1160.

The housing 140 receives the bobbin 1110, in which the first coil 1120is disposed or mounted, and supports the magnet 1130, the first sensingcoil 1171 and the second sensing coil 1172.

FIG. 19a is a first perspective view of the housing 1140 shown in FIG.16, FIG. 19b is a second perspective view of the housing 1140 shown inFIG. 16, and FIG. 20 is a cross-sectional view of the lens movingapparatus 1100 shown in FIG. 17 taken along line A-B.

Referring to FIGS. 19a, 19b and 20, the housing 1140 may have a hollowpillar shape and may include the plurality of side portions 1141 andsecond side portions 1142 forming the hollowness.

For example, the housing 1140 may include the first side portions 1141spaced apart from each other and the second side portions 1142 spacedapart from each other.

Each of the first side portions 1141 of the housing 1140 may be disposedor located between two adjacent second side portions 1142 to connect thesecond side portions 1142 to each other, and may include a plane havinga certain depth.

For example, the first side portions of the housing 1140 may be replacedwith side portions and the second side portions 142 may be located atthe corners of the housing 1140 and replaced with corner portions.

The magnet 1130 may be disposed or installed on the first side portions1141 of the housing 1140, and a supporting member 1220 may be disposedon the second side portions 1141 of the housing 1140.

The housing 1140 may include first seating grooves 1146 provided at thepositions corresponding to the first and second protrusions 1111 and1112 of the bobbin 1110.

For example, when a state in which the bottom surfaces of the firstprotrusions 1111 and 1112 of the bobbin 1110 and the bottom surfaces1146 of the first seating grooves 1146 of the housing 1140 are incontact with each other is set as the initial position of the bobbin1110, the autofocus function may be controlled in a single direction(e.g., a positive Z-axis direction at the initial position).

However, for example, when a state in which the bottom surfaces of thefirst protrusions 1111 and 1112 of the bobbin 1110 and the bottomsurfaces 1146 of the first seating grooves 1146 of the housing 1140 arespaced apart from each other is set as the initial position of thebobbin 1110, the autofocus function may be controlled in both directions(e.g., a positive Z-axis direction at the initial position and anegative Z-axis direction at the initial position).

The housing 1140 may include magnet seating portions 1141 a provided inthe inner surfaces of the first side portions 1141, in order to supportor receive the magnets 1130-1 to 1130-4.

The first side portions 1141 of the housing 1140 may be disposed inparallel to the side plates of the cover member 1300. Through-hole 1147a and 1147 b, through which the supporting member 1220 passes, may beprovided in the second side portions 1142 of the housing 1140.

In addition, second stoppers 1144-1 to 1144-4 may be provided on theupper surface of the housing 1140, in order to inhibit the upper surfaceof the housing 1140 from directly colliding with the upper inner surfaceof the cover member 1300. The second stoppers 1144-1 to 1144-4 may bedisposed on the corners of the upper surface of the housing 1140.

The housing 1140 may include at least one first upper supportingprojection 1143 on the upper surfaces of the second side portions 142,for engagement with the through-hole 1152 a of the first outer frame1152 of the upper elastic member 1150, and second lower supportingprojections 1145 on the lower surfaces of the second side portions 1142,for engagement with and fixing to the through-hole 1162 a of the secondouter frame 1162 of the lower elastic member 1160.

In order not only to secure a passage, through which the supportingmember 1220 passes, but also to secure a space filled with siliconcapable of damping, the housing 1140 may include grooves 1142 a providedin the second side portions 1142. For example, the groove 1142 a of thehousing 1140 may be filled with damping silicon.

The housing 1140 may include third stoppers 1149 protruding from theside surfaces of the first side portions 1141 in the second or thirddirection. The third stoppers 1149 may inhibit the housing 1140 fromcolliding with the inner surface of the cover member 1300 when thehousing 1140 moves in the direction perpendicular to the optical axis,for example, the second and third directions.

The housing 1140 may further include a fourth stopper (not shown)protruding from the lower surface thereof, and the fourth stopper of thehousing 1140 may inhibit the bottom surface of the housing 1140 fromcolliding with the base 1210, the third coil 1230 and/or the circuitboard 1250.

By such a configuration, the housing 1140 may be spaced apart downwardlyfrom the base 1210 and may be spaced apart upwardly from the covermember 1300. Since the housing 140 is spaced apart from the base and thecover member 1300, handshake correction operation of controllingdisplacement of the housing 1140 in the direction perpendicular to theoptical axis OA may be performed.

For example, the magnets 1130-1 to 1130-4 are received inside the firstside portions 1141 of the housing 1140 without being limited thereto. Inanother embodiment, the magnets 1130-1 to 1130-4 may be disposed outsidethe first side portions 1141 of the housing 1140.

For example, at the initial position of the AF movable portion, themagnet 1130 may overlap the first coil 1120 in the directionperpendicular to the optical axis (OA) or may be aligned with the firstcoil 1120. Here, for the initial position of the AF movable portion,refer to the description of the initial position of the AF movableportion described in FIGS. 1 to 14 b.

For example, at the initial position of the movable portion, the magnets1130-1 to 1130-4 may overlap the first coil 1120 in the directionperpendicular to the optical axis (OA), for example, in the second orthird direction.

The magnets 1130-1 to 1130-4 may have a shape corresponding to that ofthe first side portions 1141 of the housing 1140, e.g., a rectangularparallelepiped shape, without being limited thereto.

The magnets 1130-1 to 1130-4 may be a unipolar magnet or a bipolarmagnet having an S-pole surface opposite to the first coil and an N-poleouter surface thereof. However, the embodiment is not limited theretoand the S- and N-poles are reversely disposed.

In the embodiment, the number of magnets 1130-1 to 1130-4 is 4, but theembodiment is not limited thereto and the number of magnets 1130 may beat least two. The surface of the magnets 1130-1 to 1130-4 opposite tothe first coil 120 may be planar, but the embodiment is not limitedthereto and the surface of the magnets 1130-1 to 1130-4 opposite to thefirst coil 120 may be curved.

Coil seating portions 1149 a in which the first sensing coil 1171 andthe second sensing coil 1172 are disposed or seated may be provided inthe first and second side portions 1141 and 1142 of the housing 1140.

The coil seating portions 1149 a may be formed by recessing portions ofthe side surfaces of the first and second side portions 1141 and 1142 ofthe housing 1140.

Alternatively, in another embodiment, the coil seating portions may beformed by recessing the edges of the upper surface of the housing 1140.

For example, the coil seating portions 1149 a of the housing 1140 may belocated in the edge region of the upper surface of the housing 1140adjacent to the corners where the upper surfaces and the outer surfacesof the first and second side portions 1141 and 1142 meet.

For example, the coil seating portions 1149 a of the housing 1140 andthe upper surface 140 may have stairs in a vertical direction or thefirst direction.

For example, the coil seating portions 1149 a of the housing 1140 mayinclude supporting surfaces 1149-1 a and 1149-2 a located below theupper surfaces of the first and second side portions 1141 and 1142 ofthe housing 1140 and side surfaces 1149-1 b and 1149-2 b located betweenthe upper surface of the housing 1140 and the supporting surfaces 1149-1a and 1149-2 a of the housing 1140.

For example, the supporting surfaces 1149-1 a and 1149-2 a of the coilseating portions 1149 a of the housing 1140 may be located below theupper surface of the housing 1140 and the stairs may be present in thefirst direction between the supporting surfaces 1149-1 a and 1149-2 a ofthe coil seating portions 1149 a and the upper surface of the housing1140.

For example, the stairs between the supporting surfaces 1149-1 a and1149-2 a of the coil seating portions 1149 a and the upper surface ofthe housing 1140 may be equal to or greater than a sum of thethicknesses of the first sensing coil 1171 and the second sensing coil1172, without being limited thereto.

The second stoppers 1144-1 to 1144-4 of the housing 1140 may be disposedon the corners of the upper surface of the housing 1140 and protrudeupwardly from the upper surface of the housing 1140, thereby inhibitingthe first sensing coil 1171 and the second sensing coil 1172 disposed inthe coil seating portions 1149 a from being detached from the housing1140.

The first sensing coil 1171 and the second sensing coil 1172 may bedisposed on the upper surface of the housing 1140 or the upper outersurfaces of the first and second side portions 1141 and 1142 of thehousing 1140. By placing the first and second sensing coils 1171 and1172 as far as away as possible from the third coil 1230, it is possibleto minimize influence on the voltage induced in the first and secondsensing coils 1171 and 1172 by interference with the third coil 1230.

For example, the first sensing coil 1171 and the second sensing coil1172 may be disposed in the coil seating portions 1149 a of the housing1140, without being limited thereto.

For example, in another embodiment, the first sensing coil 1171 and thesecond sensing coil 1172 may be disposed on the inner surfaces of thefirst and second side portions 1141 and 1142 of the housing 1140.

Each of the first sensing coil 1171 and the second sensing coil 1172 maybe wound on the outer surfaces of the first and second side portions1141 and 1142 of the housing 1140 in a clockwise or counterclockwisedirection with respect to the optical axis OA. For example, each of thefirst sensing coil 1171 and the second sensing coil 1172 may have aclosed loop shape wound on the upper portion of the outer portion of thehousing 1140 to rotate clockwise or counterclockwise about the opticalaxis, e.g., a coil ring shape. For example, in FIG. 16, the firstsensing coil 1171 and the second sensing coil 1172 may have arectangular ring shape without being limited thereto. In anotherembodiment, the first sensing coil 1171 and the second sensing coil 1172may have a circular or elliptical shape.

FIGS. 23a to 23b are views showing embodiments of arrangement of thefirst sensing coil 1171 and the second sensing coil 1172 disposed in thehousing 1140 of FIG. 17.

Referring to FIG. 23a , the second sensing coil 1172 may be disposed onthe first sensing coil 1171 and may be in contact with the first sensingcoil 1171 and the second sensing coil 1172.

For example, the lower surface of the first sensing coil 1171 may be incontact with the supporting surfaces 1149-1 a and 1149-2 a of theseating portions 1149 a of the housing 1140, and the lower surface ofthe second sensing coil 1172 may be in contact with the upper surface ofthe first sensing coil 1171.

In another embodiment, the first sensing coil 1171 may be disposed underthe second sensing coil 1172 to be spaced apart from the second sensingcoil 1172.

In order to easily induce a voltage due to mutual induction, the secondand third coils 1171 and 1172 may be disposed in the same form as thewinding form of the first coil 1120.

For example, when the first coil 1120 has a ring shape wound in theclockwise or counterclockwise direction with respect to the opticalaxis, each of the first sensing coil 1171 and the second sensing coil1172 may have a ring shape wound on the outer side portion of thehousing 1140 to rotate in the clockwise or counterclockwise directionwith respect to the optical axis.

For example, each of the first sensing coil 1171 and the second sensingcoil 1172 may have a ring shape to surround the side surfaces 1149-1 band 1149-2 b of the seating portions 1149 of the housing 1140, and maybe in contact with the side surfaces 1149-1 b and 1149-2 b of theseating portions 1149 of the housing 1140.

Referring to FIG. 23b , the first sensing coil 1171 may be disposed onthe second sensing coil 1172. In another embodiment, the second sensingcoil 1172 may be disposed under the first sensing coil 1171 to be spacedapart from the first sensing coil 1171.

In another embodiment, the second sensing coil 1172 may be disposed onthe outer portion of the first sensing coil 1171 or may be disposed tosurround the outer portion of the first sensing coil 1171.

For example, the second sensing coil 1172 may be disposed outside thefirst sensing coil 1171. By making the distance between the firstsensing coil 1171 and the first coil 1120 and the distance between thesecond sensing coil 1172 and the first coil 1120 equal or similar, it ispossible to make the levels of the voltages induced in the first sensingcoil 1171 and the second sensing coil 1172 equal or similar.

By making the levels of the voltages induced in the first sensing coil1171 and the second sensing coil 1172 equal or similar, the embodimentcan facilitate calibration for noise removal.

In another embodiment, the first sensing coil 1171 may be disposed onthe outer portion of the second sensing coil 1172 or may be disposed tosurround the outer portion of the second sensing coil 1172. For example,the first sensing coil 1171 may be disposed outside the second sensingcoil 1172. By making the distance between the first sensing coil 1171and the first coil 1120 and the distance between the second sensing coil1172 and the first coil 1120 equal or similar, it is possible to makethe levels of the voltages induced in the first sensing coil 1171 andthe second sensing coil 1172 equal or similar.

The first sensing coil 1171 and the second sensing coil 1172 may befixed or coupled to the coil seating portions 1149 a of the housing 1140using epoxy, a thermohardening adhesive or an ultraviolet hardeningadhesive, etc.

FIG. 24a is a view showing arrangement of a first sensing coil 2171 anda second sensing coil 2172 according to another embodiment, FIG. 24b isa perspective view except for the first sensing coil 2171 and the secondsensing coil 2172 of FIG. 24a , and FIG. 24c is a view showing anembodiment of the first sensing coil 2171 and the second sensing coil2172 shown in FIG. 24 a.

Referring to FIGS. 24a to 24c , the first sensing coil 2171 and thesecond sensing coil 2172 may be disposed on the outer surface of any oneof the first side portions of the housing 1140 and may have a ringshape.

Each of the first sensing coil 2171 and the second sensing coil 2172 mayhave a coil ring shape wound in the clockwise or counterclockwisedirection with respect to the axis perpendicular to the optical axis OA.

Referring to FIG. 24a , seating portions 2142 in which the first andsecond sensing coils 2171 and 2172 are seated may be provided in theouter surface of any one first side portion of the housing 1140.

For example, the seating portions 2142 of the housing 1140 may include agroove 2142 a recessed from the outer surface of any one first sideportion of the housing 1140 in order to seat the first and secondsensing coils 2171 and 2172 and a projection 2142 b protruding from thegroove 2142 a in order to fix the first and second sensing coils 2171and 2172. The first and second sensing coils 2171 and 2172 may becoupled to, installed on or wound on the projection 2142 b.

For example, each of the first sensing coil 2171 and the second sensingcoil 2172 may have a closed curve shape including straight lines andcurved lines and may be inserted into the projection 2142 b to bedisposed in the groove 2142 a.

The first sensing coil 2171 may be disposed in the groove 2142 a to bein contact with the first side portions of the housing 1140 and thesecond sensing coil 2172 may be disposed outside the first sensing coil2171, without being limited thereto.

In another embodiment, the second sensing coil 2172 may be disposed inthe groove 2142 a to be in contact with the first side portions of thehousing 1140 and the first sensing coil 2171 may be disposed outside thesecond sensing coil 2172.

The upper elastic member 1150 and the second lower elastic member 1160may be coupled to the bobbin 1110 and the housing 1140 to flexiblysupport the bobbin 1110.

FIG. 21 is an assembled perspective view of the upper elastic member1150, the lower elastic member 1160, the third coil 1230, the circuitboard 1250, the base 1210 and the supporting member 1220 of FIG. 16, andFIG. 22 is an exploded perspective view of the third coil 1230, thecircuit board 1250, the base 1210, and first and second position sensors1240 a and 1240 b.

Referring to FIGS. 21 and 22, the upper elastic member 1150 may includea plurality of divided upper springs 1150-1 to 1150-6. For example, theupper elastic member 1150 may include the first to sixth upper springs1150-1 to 1150-6 spaced apart from each other.

Each of the first to fourth upper springs 1150-1 to 1150-4 may include afirst inner frame 1151 coupled to the bobbin 1110, a first outer frame1152 coupled to the housing 1140, and a first connector 1153 connectingthe first inner frame 1151 with the first outer frame 1152.

For example, by an adhesive member such as epoxy or thermal fusion, thethrough-hole 1151 a of the first inner frame 1151 and the firstengagement projection 1113 a of the bobbin 1110 may be engaged with eachother, and the through-hole 1152 a of the first outer frame 1152 and thefirst upper supporting projection 1143 of the housing 1140 may beengaged with each other.

Each of the fifth and sixth upper springs 1150-5 and 1150-6 may not becoupled to the bobbin 1110 but may be coupled to only the housing 140,without being limited thereto. In another embodiment, the fifth andsixth upper springs may be coupled to both the bobbin and the housing.

The lower elastic member 1160 may include a plurality of divided lowersprings.

For example, the lower elastic member 1160 may include a first lowerspring 1160-1 and a second lower spring 1160-2 spaced apart from eachother.

Each of the first and second lower springs 1160-1 and 1160-2 may includea second inner frame 1161 coupled to the bobbin 1110, a second outerframe 1162 coupled to the housing 1140 and a second connector 1163connecting the second inner frame 1161 with the second outer frame 1162.

The first coil 1120 may be connected to any two of the first and secondinner frames of the upper and lower elastic members 1150 and 1160.

For example, both ends of the first coil 120 may be connected or bondedto the second inner frames of the first and second lower springs 1160-1to 1160-2, by soldering or a conductive adhesive member.

The first sensing coil 1171 may be connected to the other two of thefirst and second inner frames of the upper and lower elastic members1150 and 1160, and the second sensing coil 1172 may be connected to theother two of the first and second inner frames of the upper and lowerelastic members 1150 and 1160.

For example, the first sensing coil 1171 may be connected to the firstinner frames of two of the first to fourth upper springs 1150-1 to1150-4 by soldering or a conductive adhesive member.

The second sensing coil 1172 may be connected to the first inner framesof the other two of the first to fourth upper springs 1150-1 to 1150-4by soldering or a conductive adhesive member.

For example, the first sensing coil 1171 may be connected or bonded tothe first and second upper springs 1150-1 and 1150-2, and the secondsensing coil 1172 may be connected or bonded to the third and fourthupper springs 1150-3 and 1150-4.

The base 1210 may be located under the bobbin 1110 and the housing 1140,and may have a supporting groove in a surface opposite to a portion inwhich the terminal surface 1253 of the circuit board 1250 is formed.

In addition, the base 1210 may include seating grooves 1215 a and 1215 brecessed from the upper surface thereof to have the position sensors1240 a and 1240 b disposed therein.

The first and second position sensors 1240 a and 1240 b may be disposedin the seating grooves 1215 a and 1215 b of the base 1210 located underthe circuit board 1250 and may be electrically connected to the circuitboard 1250.

When the housing 1140 moves in the second direction and/or the thirddirection, the first and second position sensors 1240 a and 1240 b maydetect change in magnetic force emitted from the magnet 1130.

For example, the first and second position sensors 1240 a and 1240 b maybe implemented as a Hall sensor alone or as a driver including a Hallsensor. This is merely an example and any sensor capable of detecting aposition in addition to magnetic force may be used. The first and secondposition sensors 1240 a and 1240 b may also be referred to as opticalimage stabilizer (OIS) position sensors.

The third coil 1230 may be disposed at the upper side of the circuitboard 1250 and the first and second position sensors 1240 a and 1240 bmay be disposed at the lower side of the circuit board 250.

The circuit board 1250 may be disposed on the upper surface of the base1210, and may include a hollowness corresponding to the hollowness ofthe bobbin 1110, the hollowness of the housing 1140 and/or thehollowness of the base 1210.

The circuit board 250 may include at least one terminal surface 1253bent from the upper surface thereof, electrically connected to thesupporting member 220 and having formed thereon a plurality of terminals1251 or pins for receiving electrical signals from the outside orproviding electrical signals to the outside.

The circuit board 1250 may be a flexible printed circuit board (FPCB)without being limited thereto and the terminal of the circuit board 1250may be configured on the surface of the base 1210 or a PCB using asurface electrode method.

The third coil 1230 may be disposed on the upper surface of the circuitboard 1250 to correspond to or to be aligned with the magnet 1130. Thenumber of third coil 1230 may be one or more and may be equal to thenumber of magnets 1130, without being limited thereto.

For example, the third coil 1230 may include a plurality of OIS coils1230-1 to 1230-4 formed in a circuit member 1231 (or the board)separately from the circuit board 1250, without being limited thereto.In another embodiment, the OIS coils 1230-1 to 1230-4 may be spacedapart from each other on the circuit board 1250 without a separatecircuit member or a board.

The OIS coils 1230-1 to 1230-4 may be electrically connected to thecircuit board 1250.

The driving signal, e.g., driving current, may be provided to the OIScoils 1230-1 to 1230-4. By electromagnetic force due to interactionbetween the magnet 1130 and the OIS coils 1230-1 to 1230-4, to which thedriving signal is provided, the housing 1140 may move in the directionperpendicular to the optical axis, e.g., the second direction and/or thethird direction, for example, the x-axis and/or y-axis direction.Handshake correction may be performed by controlling movement of thehousing 1140. The driving signal applied to the OIS coils 1230-1 to1230-4 may be an AC signal, e.g., a PWM signal. For example, the drivingsignal applied to the OIS coils 1230-1 to 1230-4 may include an ACsignal and a DC signal.

By soldering or a conductive adhesive member 901, one end of each of thesupporting members 1220-1 to 1220-6 may be coupled to each of the uppersprings 1150-1 to 1150-6 and the other end thereof may be bonded to thecircuit board 1259, the circuit member 231 and/or the base 1210.

In addition, one end of each of the supporting members 1220-7 and 1220-8may be coupled to each of the upper springs 1150-5 and 1150-6 and theother end thereof may be coupled to each of the upper springs 1160-1 and1160-2. The supporting member 1120 may support the bobbin 110 and thehousing 1140 such that the bobbin 1110 and the housing 1140 are movablein the direction perpendicular to the first direction.

A plurality of supporting members 1220 may be provided and each of theplurality of supporting members 1220-1 to 1220-8 may be disposed in eachof the second side portions of the housing 1140.

Although the first supporting member 1220-1 may include two wires 1220 a1 and 1220 b 1 and the third supporting member 1220-3 may include twowires 1220 a 2 and 1220 b 2 in order to symmetrically place thesupporting members in FIG. 21, the embodiment is not limited thereto andthe supporting members may be symmetrically disposed in various forms,such that the supporting members may support the housing in a balancedmanner. At least one of the two wires 1220 a 1 and 1220 b 1 or 1220 a 2and 1220 b 2 may be electrically connected to the circuit board.

The plurality of supporting members 1220-1 to 1220-8 may be formed by amember separately from the upper elastic member 1150 and may beimplemented as an elastically supportable member, e.g., a left spring, acoil spring, a suspension wire, etc. The supporting member 1220according to another embodiment may be formed integrally with the upperelastic member 1150.

For example, each of the first to sixth supporting members 1220-1 to1220-6 may electrically connect any one of the first to sixth uppersprings 1150-1 to 1150-6 with the circuit board 1250.

The seventh support 1220-7 connects the fifth upper spring 1150-5 withthe first lower elastic member 1160-1, and the eighth member 1220-8connects the sixth upper spring 1150-6 with the second lower elasticmember 1160-2.

For example, the first coil 1120 connected to the first and second lowersprings 1160-1 and 1160-2 may be electrically connected to the circuitboard 1250 by the seventh and eighth supporting members 1220-7 and1220-8 and the fifth and sixth upper springs 1150-5 and 1150-6.

The first sensing coil 1171 connected to the first and second uppersprings 1150-1 and 1150-2 may be connected to the circuit board 1250 bythe first and second supporting members 1220-1 and 1220-2.

The second sensing coil 1172 connected to the third and fourth uppersprings 1150-3 and 1150-4 may be electrically connected to the circuitboard 1250 by the third and fourth supporting members 1220-3 and 1220-4.

In order to absorb and damp vibration of the bobbin 1110, the lensmoving apparatus 1100 may further include a first damping member (notshown) disposed between each of the upper springs 1150-1 to 1150-6 andthe housing 1140.

For example, the first damping member (not shown) may be disposed in aspace between the first connector 1153 of each of the upper springs1150-1 to 1150-4 and the housing 1140.

In addition, for example, the lens moving apparatus 1100 may furtherinclude a second damping member (not shown) disposed between the secondconnectors 1163 of the lower elastic members 1160-1 to 1160-2 and thehousing 1140.

In addition, for example, the lens moving apparatus 1100 may furtherinclude a damping member (not shown) disposed between the inner surfaceof the housing 1140 and the outer circumferential surface of the bobbin1110.

In addition, the lens moving apparatus 1100 may further include adamping member (not shown) disposed in a portion where the supportingmember 1220 and the upper elastic member 1150 are coupled or bonded.

In addition, the lens moving apparatus 1100 may further include adamping member (not shown) disposed in a portion where the circuit board1250, the circuit member 1231 1231 and/or the base 1210 and thesupporting member 1220 are coupled or bonded.

FIG. 25a shows one embodiment of the first coil 1120, the first sensingcoil 1171, and the second sensing coil 1172 shown in FIG. 16, and FIG.25b shows another embodiment of the first coil 1120, the first sensingcoil 1171, and the second sensing coil 1172 shown in FIG. 16.

In FIG. 25a , one end of the first sensing coil 1171 and one end of thesecond sensing coil 1172 may be connected to each other. For example, anode, to which the first sensing coil 1171 and the second sensing coil1172 are commonly connected, may serve as an intermediate tap 22 c and aground voltage GND may be provided thereto. Conductible connection ofFIGS. 25a and 25b may be provided on the circuit board 1250 or thesecond holder 800 of the camera module 200.

When a first driving signal Id1 is provided to the first coil 1120, afirst induced voltage V1 may be generated between one end 22 a of thefirst sensing coil 1171 and the intermediate tap 22 c, and a secondinduced voltage V2 may be generated between one end 22 b of the secondsensing coil 1172 and the intermediate tap 22 c.

In FIG. 25b , the first sensing coil 1171 and the second sensing coil1172 are electrically disconnected from each other. When the firstdriving signal ID1 is provided to the first coil 1120, the first inducedvoltage V1 may be generated at both ends 23 a and 23 b of the firstsensing coil 1171, and the second induced voltage V2 may be generated atboth ends 24 a and 24 b of the second sensing coil 1172.

The first driving signal Id1 may be provided from the circuit board 1250to the first coil 1120. The first driving signal Id1 applied to thefirst coil 120 may be an AC signal, e.g., AC current or an AC voltage.For example, the first driving signal Id1 may be a sine signal or apulse signal (e.g., pulse width modulation (PWM) signal).

In another embodiment, the first driving signal Id1 applied to the firstcoil 1120 may include an AC signal and a DC signal. When the AC signal,e.g., AC current, is applied to the first coil 1120, electromotive forceor a voltage is induced in the first sensing coil 1171 and the secondsensing coil 1172 by mutual induction. The frequency of the PWM signalmay be 20 kHz or more and may be 500 kHz or more for reduction ofcurrent consumption.

As the first coil 1120 disposed in the bobbin 1110 moves in theoptical-axis direction by electromotive force due to interaction withthe magnet, the distance D1 between the first coil 1120 and the firstsensing coil 1171 and the distance D2 between the first coil 1120 andthe second sensing coil 1172 may be changed.

As the first and second distances D1 and D2 are changed, the firstinduced voltage V1 may be induced in the first sensing coil 1171 and thesecond induced voltage V2 may be induced in the second sensing coil1172.

Each of the first sensing coil 1171 and the second sensing coil 1172 maybe an induced coil in which the induced voltage is generated in order todetect the position or displacement of the movable portion, e.g., thebobbin.

For example, the position or displacement of the movable portion may bedetected using the first induced voltage V1 induced in the first sensingcoil 1171 and the second induced voltage V2 induced in the secondsensing coil 1172.

The detector 1241 detects displacement of the movable portion based onthe result of comparing the first induced voltage V1 with the secondinduced voltage V2. The detector 1241 may be electrically connected tothe circuit board 1250 as shown in FIG. 22.

For example, a groove 1215-3 in which the detector 1241 is seated may beprovided in the upper surface of the base 1210, and the detector 1241may be bonded to the lower surface of the circuit board 1250 andelectrically connected to the terminals 1251 of the circuit board 1250.

For example, the detector 1241 may be electrically connected to theterminals of the circuit board 1250 electrically connected to the firstsensing coil 1171 and the second sensing coil 1172.

In another embodiment, the detector 1241 may not be disposed on thecircuit board 1250, but may be included in the controller 1830 of thecamera module 200 shown in FIG. 29.

FIG. 26a shows an embodiment of the waveforms of the first inducedvoltage V1 of the first sensing coil 1171 and the second induced voltageV2 of the second sensing coil 1172 generated in response to the firstdriving signal Id1.

Referring to FIG. 26a , the first driving signal Id1 applied to thefirst coil 1120 may be current or a voltage including a DC signal (e.g.,DC1) and an AC signal (e.g., a pulse signal).

In response to the first driving signal Id1 which is a pulse wave, thefirst induced voltage V1 which is an AC signal may be generated in thefirst sensing coil 1171 and the second induced voltage V2 which is an ACsignal may be generated in the second sensing coil 1172.

When the number of turns of the first sensing coil 1171 and the numberof turns of the second sensing coil 1172 are the same, the thickness andmaterials of the second and third coils 11711 and 1172 are equal to eachother, and when the third and second distances are the same, the firstinduced voltage V1 and the second induced voltage V2 may be equal toeach other. For example, the maximum values of the first and secondinduced voltages V1 and V2 may be Max1.

Even if the numbers of turns are not equal, considering the ratio of thenumber of turns of the first sensing coil 1171 to the number of turns ofthe second sensing coil 1172, the first induced voltage V1 of the firstsensing coil 1171 and the second induced voltage V2 of the secondsensing coil 1172 may be generated according to the ratio of the numberof turns of the first sensing coil 1171 to the number of turns of thesecond sensing coil 1172.

At least one of the first induced voltage V1 of the first sensing coil1171 or the second induced voltage V2 of the second sensing coil 1172may be influenced by noise due to the surrounding environments of thefirst and second sensing coils 1171 and 1172.

For example, noise due to the surrounding environment may include noisecaused by a receiver, a speaker or a vibration motor of a camera module,in which the lens moving apparatus is installed, or circuit noise. Suchnoise may obstruct accurate detection of displacement of the movableportion. Accuracy of AF operation may be deteriorated by influence ofsuch noise.

As shown in FIG. 26a , the first induced voltage V1 of the first sensingcoil 1171 may include a component or voltage VN1 (hereinafter referredto as a noise voltage) caused by noise. In contrast, the second inducedvoltage V1 of the second coil 1172 may not be influenced by noise andmay not include a noise voltage.

For example, the noise voltage VN1 may be present between the firstinduced voltage waves VW1 of the first induced voltage V1 generated inresponse to the first driving signal Id1 in time, without being limitedthereto. For example, the noise voltage VN1 may not be generated byoverlapping or synchronization with the first induced voltage waves VW1in time.

Since at least a portion of the noise voltage VN1 overlaps the firstinduced voltage waveforms VW1 in time not to be generated in the firstsensing coil 1171, when the first sensing coil 1171 and the secondsensing coil 1172 are equal to each other in terms of the number ofturns, the thickness and the material, the first induced voltage VW1 ofthe first sensing coil 1171 and the second induced voltage VW2 of thesecond sensing coil 1172 may be equal to each other.

The second induced voltage V2 of FIG. 26a may not include the noisevoltage VN1, without being limited thereto. In another embodiment, thesecond induced voltage V2 may include the noise voltage and the firstinduced voltage V1 may not include the noise voltage. In anotherembodiment, both the first induced voltage V1 and the second inducedvoltage V2 may respectively include noise voltages. At this time, thenoise voltages respectively included in the first induced voltage V1 andthe second induced voltage V2 may not overlap each other in time,without being limited thereto.

The first induced voltage waveform VW1 and the second induced voltagewaveform VW2 shown in FIG. 26a respectively include an upper portion anda lower portion of the DC voltage DC2 and the absolute value of themaximum value Max1 of the upper portion is greater than the absolutevalue of the minimum value of the lower portion, without being limitedthereto. In another embodiment, the absolute value of the maximum valueMax1 of the upper portion may be less than or equal to the absolutevalue of the minimum value of the lower portion.

FIG. 26b shows another embodiment of the waveforms of the first inducedvoltage V1 of the first sensing coil 1171 and the second induced voltageV2 of the second sensing coil 1172 generated in response to the firstdriving signal Id1.

In FIG. 26b , the first induced voltage V1 of the first sensing coil1171 may include a noise voltage and may not be influenced by the noiseof the second induced voltage V2.

In FIG. 26b , the noise voltage may be generated by overlapping with thefirst induced voltage waveform VW1 of the first induced voltage V1 intime.

Accordingly, in FIG. 26b , the waveform VW1′ of the first voltage V1generated in the first sensing coil 1171 may be the result of summingthe noise voltage and the first induced voltage waveforms VW1 generatedby mutual induction with the first coil 1120.

The waveform VW1′ of the first voltage V1 generated in the first sensingcoil 1171 of FIG. 26b is different from the second induced voltagewaveforms VW2 of the second induced voltage V2 of the second sensingcoil 1172.

For example, the first voltage V1 of the first sensing coil 1171 is thesum of the first induced voltage VW1 and the noise voltage, the maximumvalue Max2 of the first voltage V1 of the first sensing coil 1171 may begreater than the maximum value Max of the second induced voltagewaveforms VW2.

FIG. 27 shows an embodiment 1241 a of the detector 1241 shown in FIG.22.

Referring to FIG. 27, the detector 1241 a may include a comparator 530for comparing the first induced voltage V1 with the second inducedvoltage V2 and outputting a comparison signal CS according to the resultof comparison and a controller 540 for generating a detected signal Psbased on the comparison signal CS and outputting the generated detectedsignal Ps.

Since the first induced voltage V1 and the second induced voltage V2 aresmall, in order to make a difference therebetween large enough tocompare the first and second induced voltages, the embodiment mayinclude amplifiers 510 and 520 for amplifying the first induced voltageV1 and the second induced voltage V2.

For example, the detector 1241 a may further include a first amplifier510 for amplifying the first induced voltage V1 and outputting a firstamplified signal AV11 and a second amplifier 520 for amplifying thesecond induced voltage V2 and outputting a second amplified signal AV21.

For example, the comparator 530 may output the comparison signal CSaccording to the result of comparing the first and second amplifiedsignals AV1 and AV2. The comparator 520 shown in FIG. 27 may be ananalog comparator for comprising the first and second induced voltagesV1 and V2 which are analog signals.

The amplification factor or gain of each of the first and secondamplifiers 510 and 520 may be based on the number of turns of the firstand second sensing coils 1171 and 1172.

For example, a first ratio of the amplification factor or gain of thefirst amplifier 510 to the number of turns of the first sensing coil1171 may be equal to a second ratio of the amplification ratio or gainof the second amplifier 520 to the number of turns of the second sensingcoil 1172. Alternatively, for example, a ratio of the first ratio to thesecond ratio or a difference between the first ratio and the secondratio may have a certain value.

For example, if there is no influence of noise, even when the numbers ofturns of the first and second sensing coils 1171 and 1172 are differentfrom each other, by controlling the amplification rate or gain of thefirst and second amplifiers 510 and 520, the first amplified signal AV1and the second amplified signal AV2 may be controlled to be equal toeach other or to have a certain voltage ratio.

The comparator 530 compares the first induced voltage V1 with the secondinduced voltage V2 and outputs the comparison signal CS according to theresult of comparison.

The comparator 530 may output the comparison signal CS according to theresult of comparing the levels of the first and second amplifiedvoltages AV1 and AV2.

For example, the comparator 530 may output the comparison signal CSaccording to the result AV1-AV2 of subtracting the second amplifiedvoltage AV2 from the first amplified voltage AV1.

The controller 540 outputs the detected signal Ps based on thecomparison signal CS.

For example, if the comparison signal CS is in a reference error range,the controller 540 may determine that the first induced voltage V1 ofthe first coil 1171 and the second induced voltage of the second coil1172 are not influenced by noise and output any one of the first inducedvoltage V1 or the second induced voltage V2 as the detected signal Ps oroutput the average value of the first induced voltage V1 and the secondinduced voltage V2 as the detected signal Ps. In addition, thecontroller 540 may detect displacement of the movable portion based onthe detected signal Ps and control displacement of the movable portion.

In addition, for example, the controller 540 may correct the firstinduced voltage V1 or the second induced voltage V2 based on thecomparison signal CS when the comparison signal CS is out of thereference error range, output the corrected first induced voltage V1 orthe corrected second induced voltage V2 as the detected signal Ps,detect displacement of the movable portion based on the detected signalPs, and control displacement of the movable portion.

Here, the reference error range is an error range in which it may bedetermined that the first induced voltage V1 and the second inducedvoltage V2 may be substantially equal, and may be determined accordingto the levels of the first and second induced voltages V1 and V2. Thelower limit of the error range may be a negative value and the upperlimit of the error range may be a positive value.

For example, if the comparison signal CS according to the result V1-V2of subtracting the second induced voltage V2 from the first inducedvoltage V1 has a positive value outside the reference error range, thecontroller 540 may determine that the first induced voltage V1 includesnoise, correct the first induced voltage V1 based on the level of thecomparison signal CS, and output the corrected first induced voltage V1as the detected signal Ps or output the second induced voltage V2without noise as the detected signal Ps.

In contrast, if the comparison signal CS according to the result V1-V2of subtracting the second induced voltage V2 from the first inducedvoltage V1 has a negative value outside the reference error range, thecontroller 540 may determine that the second induced voltage V2 includesnoise, correct the second induced voltage V2 based on the level of thecomparison signal CS, and output the corrected second induced voltage V2as the detected signal Ps or output the first induced voltage V1 withoutnoise as the detected signal Ps.

The lens moving apparatus 100 according to the embodiment of FIG. 1 mayinclude the amplifier 310 for amplifying the induced voltage of thesensing coil 170 and outputting the amplified signal AV1.

The lens moving apparatus 1100 according to the embodiment of FIG. 27may include a first amplifier 510 for amplifying the first inducedvoltage V1 of the first sensing coil 1171 and outputting a firstamplified signal and a second amplifier 520 for amplifying the secondinduced voltage V2 of the second sensing coil 1172 and outputting asecond output signal AV2.

In addition, the detector according to another embodiment may includethe first amplifier 510 and the second amplifier 520 of FIG. 27 disposedon the circuit board 1250, the comparator 530 and the controller 540 ofFIG. 27 may be omitted, and the comparator 530 and the controller 540may be disposed in the camera module (e.g., the second holder 600 of thecamera module) or the optical instrument.

FIG. 28 shows another embodiment 1241 b of the detector 1241 shown inFIG. 22.

Referring to FIG. 28, the detector 1241 b may include ananalog-to-digital converter 550, a comparator 560 and a controller 570.

The analog-to-digital converter 550 outputs a first digital signal Dig1according to the result of analog-to-digital converting the firstinduced voltage V1 and a second digital signal Dig2 according to theresult of analog-to-digital converting the second induced voltage V2.

For example, the analog-to-digital converter 550 may output the firstand second digital signals Dig1 and Dig2 according to the result ofremoving the lower portions of the first and second induced voltagewaveforms VW1, VW2 and VW1′ of FIGS. 26a and 26b and analog-to-digitalconverting only the upper portions of the first and second inducedvoltage waveforms VW1, VW2 and VW1′.

The comparator 560 compares the first digital signal Dig with the seconddigital signal Dig2 and outputs a comparison signal DS according to theresult of comparison. At this time, the comparison signal DS is adigital signal.

If the value of the comparison signal DS is 0, the controller 570 maydetermine that the first induced voltage V1 of the first coil 1171 andthe second induced voltage of the second coil 1172 are not influenced bynoise, output any one of the first induced voltage V1 or the secondinduced voltage V2 as the detected signal Ps, detect displacement of themovable portion based on the detected signal Ps, and controldisplacement of the movable portion.

If the value of the comparison signal DS is a positive value, thecontroller 570 may determine that the first induced voltage V1 includesnoise, correct the first digital signal Dig1 based on the level of thecomparison signal DS, and output the corrected first digital signal Dig1as the detected signal Ps or output the second digital signal Dig2,which is not influenced by noise, as the detected signal.

In contrast, if the value of the comparison signal DS is a negativevalue, the controller 570 may determine that the second induced voltageV2 includes noise, correct the second digital signal Dig2 based on thelevel of the comparison signal DS, and output the corrected seconddigital signal Dig2 as the detected signal Ps or output the firstdigital signal Dig1, which is not influenced by noise, as the detectedsignal.

The voltage induced in the sensing coil by mutual induction with thefirst coil, to which the driving signal is applied, is influenced bynoise caused by the surrounding environment. The embodiment may includetwo sensing coils, e.g., the first and second sensing coils 1171 and1172, and generate a detected signal for detecting displacement of themovable portion based on the result of comparing the first and secondinduced voltages V1 and V2 in the first and second sensing coils 1171and 1172, thereby determining influence of noise caused by thesurrounding environment and removing noise. Therefore, it is possible toaccurately detect the position of the movable portion and to increaseaccuracy of AF operation.

FIG. 30a shows an embodiment of the first coil 1120 and the first andsecond sensing coils 1171 and 1172 for temperature compensation, andFIG. 30b shows another embodiment of the first coil 1120 and the firstand second sensing coils 1171 and 1172 for temperature compensation.

FIG. 30a may be the same as the arrangement of the first coil 1120 andthe first and second sensing coils 1171 and 1172 shown in FIG. 25a , andFIG. 30b may be the same as the arrangement of the first coil 1120 andthe first and second sensing coils 1171 and 1172 shown in FIG. 25 b.

Although the driving signal is not applied to the second sensing coil1172 in FIGS. 25a and 25b , a second driving signal Id2 for temperaturecompensation may be applied to the second sensing coil 1172 in FIGS. 30aand 30 b.

Referring to FIGS. 30a and 30b , a first voltage V1′ generated in thefirst sensing coil 1171 may be the first induced voltage V1 generated bymutual induction with the first coil 1120 (V′=V1).

A second voltage V2′ generated in the second sensing coil 1172 may be asum of the second induced voltage V2 generated by mutual induction withthe first coil 1120 and a voltage Vb generated by the second drivingsignal Id2 (V2′=V2+Vb).

The voltage Vb of the second sensing coil 1172 may be a voltage due tovoltage drop generated by the second driving signal Id2 and a resistancecomponent of the second sensing coil 1172.

The second driving signal Id2 is applied to the second sensing coil1172.

The second driving signal Id2 may be an AC signal, e.g., AC current oran AC voltage. For example, the second driving signal Id2 may be a sinewave signal or a pulse signal (e.g., a PWM) signal. Alternatively, forexample, the second driving signal Id2 may include an AC signal or a DCsignal.

For example, in FIG. 30a , the second driving signal Id2 may be currentflowing from one end 22 b of the second sensing coil 1172 to theintermediate tap 22 c. In FIG. 30b , the second driving signal Id2 maybe current flowing from one end 24 a of the second sensing coil 1172 tothe other end 24 b.

FIG. 31a shows an embodiment of the first voltage V1′ generated in thefirst sensing coil 1171 and the second voltage V2′ generated in thesecond sensing coil 1172 according to the first driving signal Id1 andthe second driving signal Id2 of FIGS. 30a and 30 b.

Referring to FIG. 31a , the first driving signal Id1 and the seconddriving signal Id2 may not overlap in time. For example, the firstdriving signal Id1 and the second driving signal Id2 may not besynchronized with each other in time.

For example, the first driving signal Id2 and the second driving signalId1 may be different from each other in terms of phase. In addition, forexample, the first driving signal Id2 and the second driving signal Id1may not be equal in period without being limited thereto, and may beequal in period.

Since an interval in which the first driving signal Id1 is provided tothe first coil 1120 and an interval in which the second driving signalId2 is provided to the second sensing coil 1172 are different from eachother in time, the second induced voltage of the second sensing coil1172 generated by the first driving signal Id1, e.g., the second inducedvoltage waveform VW2, and the voltage Vb of the second sensing coil 1172generated by the second driving signal Id2 may be generated not tooverlap with each other in time.

FIG. 31b shows another embodiment of the first voltage V1′ generated inthe first sensing coil 1171 and the second voltage V2′ generated in thesecond sensing coil 1172 according to the first driving signal Id1 andthe second driving signal Id2 of FIGS. 30a and 30 b.

Referring to FIG. 31b , the first driving signal Id1 and the seconddriving signal Id2 may overlap in time. For example, the first drivingsignal Id1 and the second driving signal Id2 may be synchronized witheach other in time.

For example, the first driving signal Id1 and the second driving signalId2 may be equal to each other in phase. In addition, for example, thefirst driving signal Id2 and the second driving signal Id2 may be equalto each other in period without being limited thereto and may bedifferent from each other in period.

Since an interval in which the first driving signal Id1 is provided tothe first coil 1120 and an interval in which the second driving signalId2 is provided to the second sensing coil 1172 are synchronized witheach other in time, the second induced voltage of the second sensingcoil 1172 by the first driving signal Id1, e.g., the second inducedvoltage waveform VW2, and the voltage Vb of the second sensing coil 1172generated by the second driving signal Id2 may be summed.

In FIGS. 31a and 31b , the noise voltage VN1 caused by the surroundingenvironment may be generated not to overlap the first induced voltagewaveform VW1 in time.

The description of the noise voltage VN1, the detector 1241, noisedetermination and removal described in FIGS. 26a to 26b and 27 to 28 isequally applicable to FIGS. 31a and 31 b.

FIG. 31c shows another embodiment of the first voltage V1′ generated inthe first sensing coil 1171 and the second voltage V2′ generated in thesecond sensing coil 1172 according to the first driving signal Id1 andthe second driving signal Id2 of FIGS. 30a and 30b . In FIGS. 31c and31d , the noise voltage may be generated to overlap or be synchronizedwith the first induced voltage waveform VW1 of the first sensing coil1171 in time.

Referring to FIG. 31c , the first driving signal Id1 and the seconddriving signal Id2 are not synchronized with each other in time and thenoise voltage may be added to the first induced voltage by mutualinduction with the first coil 1171.

In FIG. 31c , the first voltage V1′ generated in the first sensing coil1171 may be a sum of the first induced voltage V1 by mutual inductionwith the first coil 1171, e.g., the first induced voltage waveform, andthe noise voltage caused by noise.

For example, the first induced voltage waveform VW1′ of the firstvoltage V1′ of the first sensing coil 1171 may be the first inducedvoltage waveform influenced by noise.

In FIG. 31c , the second voltage V2′ generated in the second coil 1172may be equal to that described in FIG. 31 a.

FIG. 31d shows another embodiment of the first voltage V1′ generated inthe first sensing coil 1171 and the second voltage V2′ generated in thesecond sensing coil 1172 according to the first driving signal Id1 andthe second driving signal Id2 of FIGS. 30a and 30 b.

Referring to FIG. 31d , the first driving signal Id1 and the seconddriving signal Id2 are synchronized with each other in time and thenoise voltage may be generated to overlap the first induced voltagewaveform of the first induced voltage V1 of the first sensing coil 1171in time.

The first voltage V1′ generated in the first sensing coil 1171 of FIG.31d may be equal to that described in FIG. 31 c.

The second voltage V2′ generated in the second sensing coil 1172 of FIG.31d may be equal to that described in FIG. 31 b.

Although the noise voltage is generated in the first sensing coil 1171and the noise voltage is not generated in the second sensing coil 1172in FIGS. 31a to 31d , the embodiment is not limited thereto. In anotherembodiment, the noise voltage may not be generated in the first sensingcoil 1171 and may be generated in the second sensing coil 1172. Inanother embodiment, the noise voltage may be generated in each of thefirst sensing coil 1171 and the second sensing coil 1172.

In general, for AF feedback control, since the AF movable portion, forexample, the position sensor capable of detecting displacement of thebobbin and a separate power control structure for driving the positionsensor are required, the price of the lens moving apparatus may increaseand a difficulty in manufacturing process may occur.

In addition, a linear region (hereinafter referred to as a first linearregion) of the graph between the movement distance of the bobbin and themagnetic flux of the magnet detected by the position sensor may belimited by the positional relationship between the magnet and theposition sensor.

In the embodiment, since displacement of the bobbin is detected by thefirst and second induced voltages V1 and V2 induced in the first andsecond sensing coils 1171 and 1172 and a separate position sensor fordetecting displacement of the bobbin 1110 is not necessary, it ispossible to reduce the cost of the lens moving apparatus and to improvethe ease of the manufacturing process.

In addition, since mutual induction between the first coil 1120 and thefirst and second sensing coils 1171 and 1172 is used, the linear regionof the graph between the movement distance of the bobbin 1110 and thefirst and second induced voltages V1 and V2 may increase as compared tothe first linear region. Accordingly, the present embodiment can securea wide range of linearity, improve a process failure rate and moreaccurately perform AF feedback control.

FIG. 32 is a view showing change in first or second induced voltage V1or V2 generated in the first sensing coil 1171 or the second sensingcoil 1172 shown in FIGS. 25a and 25b according to ambient temperature.

In FIG. 32, the abscissa represents displacement of the movable portionand the ordinate represents the first induced voltage V1 or the secondinduced voltage V2 of the first sensing coil 1171 or the second sensingcoil 1172.

f1 denotes the first or second induced voltage V1 or V2 generated in thefirst or second sensing coil 1171 or 1172 when the ambient temperatureis 25° C. and f2 denotes the first or second induced voltage V1 or V2generated in the first or second sensing coil 1171 or 1172 when theambient temperature is 65° C.

Referring to FIG. 32, the first or second induced voltage V1 or V2 mayincrease as the ambient temperature increases. Since the first inducedvoltage V1 and the second induced voltage V2 induced in the firstsensing coil 1171 and the second sensing coil 1172 are changed accordingto change in ambient temperature, the focal point of the lens mounted inthe lens moving apparatus may be changed when AF feedback driving isperformed.

For example, by AF feedback driving, the lens mounted in the lens movingapparatus has a first focal point at 25° C. and a second focal pointdifferent from the first focal point at 65° C.

The first and second induced voltages generated in the first and secondsensing coils 1171 and 1172 at 65° C. may increase as compared to thefirst induced voltage generated in the first sensing coil at 25° C., andthe lens of the lens moving apparatus moves by AF feedback driving basedon the increased first and second induced voltages.

Not only the first and second induced voltages V1 and V2 of the firstand second sensing coils 1171 and 1172 but also the focal length of thelens mounted in the lens moving apparatus are simultaneously influencedby change in ambient temperature.

For example, if the ambient temperature increases, it is possible toexpand or contract the lens mounted in the lens moving apparatus and toincrease or decrease the focal length of the lens. Expansion orcontraction of the lens may be determined according to the type of thelens.

By compensating for AF feedback driving considering change in first andsecond induced voltages and/or change in focal length of the lensaccording to change in ambient temperature, the embodiment can suppresschange in focal point of the lens according to change in ambienttemperature.

Change in ambient temperature should be detected for compensation forchange in ambient temperature. In the embodiment, the second drivingsignal Id2 may be applied to the second sensing coil 1172 and change inambient temperature may be detected based on the first voltage V1′generated in the first sensing coil 1171 and the second voltage V2′generated in the second sensing coil 1172.

The voltage Vb generated in the second sensing coil 1172 by the seconddriving signal Id2 is influenced by change in ambient temperature.

The material of the first and second sensing coils 1171 and 1172 may bemetal having a resistance value changed by temperature change, e.g.,copper (Cu). For example, the temperature resistance coefficient ofcopper (Cu) may be 0.00394 Ω/° C. Accordingly, as the ambienttemperature increases, the resistance value of the second sensing coil1172 may increase and the voltage Vb generated by the second drivingsignal Id2 may increase. In contrast, when the ambient temperaturedecreases, the voltage Vb generated by the second driving signal Id2 maydecrease. That is, the resistance value of the second sensing coil 1172and the voltage Vb generated by the second driving signal 12 may bemeasured in real time and continuously and the changed value of themeasured voltage Vb may be monitored, thereby measuring change inambient temperature.

Since the first and second induced voltages V1 and V2 of the firstsensing coil 1171 and the second sensing coil 1172 are equallyinfluenced by change in ambient temperature, a difference between thefirst induced voltage V1 and the second induced voltage V2 may beconstant even when the ambient temperature is changed. For example, whenthe numbers of turns of the first sensing coil 1171 and the secondsensing coil 1172 are the same, change in the first induced voltage V1and change in the second induced voltage V2 due to change in ambienttemperature may be the same.

As described above, the voltage Vb of the second sensing coil 1172generated by the second driving signal Id2 may be changed by influenceaccording to change in ambient temperature.

Change in difference between the voltage V1′ generated in the firstsensing coil 1171 and the second voltage V2′ generated in the secondsensing coil 1172 may be change in voltage Vb of the second sensing coil1172 according to change in ambient temperature.

Based on change in difference between the voltage V1′ generated in thefirst sensing coil 1171 and the second voltage V2′ generated in thesecond sensing coil 1172 (e.g., change in Vb), the first induced voltageV1 or V1′ generated in the first sensing coil 1171 or the second inducedvoltage V2 or V2′ generated in the second sensing coil 1172 may becorrected or compensated.

For example, it is assumed that, when the ambient temperature is a roomtemperature (e.g., 25° C.), the difference Vb between the second voltageV2′ of the second sensing coil 1172 and the voltage V1′ of the firstsensing coil 1171 is a first reference voltage.

The first induced voltage V1 or V1′ of the first sensing coil 1171 orthe second induced voltage V2 or V2′ of the second sensing coil 1172 maybe corrected or compensated, based on a degree of increase or decreasein the difference between the second voltage V2′ of the second sensingcoil 1172 and the voltage V1′ of the first sensing coil 1171 as comparedto the first reference voltage as the ambient temperature increases ordecreases.

Since the first driving signal Id1 and the second driving signal Id2 usean AC signal (e.g., a PWM signal), the lens moving apparatus 100 shownin FIG. 16 may include a capacitor connected to the first sensing coil1171 and the second sensing coil 1172 in order to remove the noisecomponent (e.g., PWM noise) included in the first and second inducedvoltages V1 and V2.

FIG. 33 is a view showing a capacitor 1175 for removing a noisecomponent.

Referring to FIG. 33, the first and second sensing coils 1171 and 1172shown in FIGS. 25a and 30a may be connected to the terminals 251-3,251-5 and 251-6 of the circuit board 1250.

For example, one end 22 a of the first sensing coil 1171 may beconnected to the third terminal 251-3 of the circuit board 1250, one end22 b of the second sensing coil 1172 may be connected to the sixthterminal 251-6 of the circuit board 1250, and the intermediate tap 22 cmay be connected to the fifth terminal 251-5 of the circuit board 1250.

On end of the capacitor 1175 may be connected to the third terminal251-3 of the circuit board 1250 and the other end of the capacitor 1175may be connected to the sixth terminal 251-6 of the circuit board 1250.

In order to remove the noise component, the lens moving apparatus 1100according to the embodiment may further include a first capacitor (notshown) connected to the first sensing coil 1171 shown in FIGS. 25b and30b in parallel or in series and a second capacitor connected to thesecond sensing coil 1172 in parallel or in series.

The first and second sensing coils 1171 and 1172 and the capacitor 1175may function as an LC low pass filter, and the cutoff frequency of thelow pass filter may be determined based on the frequency of each of thefirst driving signal Id1 and the second driving signal Id2.

In general, the equivalent circuit diagram of the coil is composed of aresistance component, an inductance component and a capacitancecomponent. The coil may cause a resonance phenomenon at a magneticresonance frequency. At this time, current flowing in the coil and avoltage thereof may be maximized.

In order to inhibit the autofocus function and the handshake correctionfunction of the lens moving apparatus 1100 from deteriorating, themagnetic resonance frequencies of the first coil 1120 and the first andsecond sensing coils 1171 and 1172 may be different from each other, andthe magnetic resonance frequency of the first and second sensing coils1171 and 1172 and the third coil 1230 may be different from each other.

For example, in order to suppress audio noise, the difference betweenthe magnetic resonance frequency of the first coil 1120 and the magneticresonance frequency of the first and second sensing coils 1171 and 1172may be 20 kHz or more. For example, the difference between the magneticresonance frequency of the first coil 1120 and the magnetic resonancefrequency of the first and second sensing coils 1171 and 1172 may be 20kHz to 3 MHz, and the difference between the magnetic resonancefrequency of the first and second sensing coils 1171 and 1172 and themagnetic resonance frequency of the third coil 1230 may be 20 kHz to 3MHz.

The magnetic resonance frequency of the third coil 1230 may be designedto be higher than that of the first coil 1120. In addition, the magneticresonance frequency of the third coil 1230 may be higher than that ofthe first and second sensing coils 1171 and 1172.

The difference between the magnetic resonance frequency of the thirdcoil 1230 and the magnetic resonance frequency of the first coil 1120may be 20 kHz or more, in order to suppress induction of the voltage inthe first coil 1120 and the first and second sensing coils 1171 and 1172by the driving signal (e.g., the PWM signal) applied to the third coil1230.

FIG. 29 is an exploded perspective view of a camera module 200-1according to another embodiment. In FIG. 29, the same reference numeralsas FIG. 15b indicate the same elements and a description of the sameelements may be simplified or omitted.

Referring to FIG. 29, the camera module 200-1 may include a lens or alens barrel 400 in which the lens is installed, a lens moving apparatus1100, a first holder 600, a filter 610, an adhesive member 612, a secondholder 800, an image sensor 810, a sensor 820, a controller 1830 and aconnector 840.

The controller 1830 may include at least one of an AF controller for AFfeedback driving or an OIS controller for performing OIS feedbackcontrol.

The controller 1830 may be installed in the second holder 800.

The AF controller may be electrically connected to the first coil 1200and the first and second sensing coils 1171 and 1172 of the lens movingapparatus 1100.

The AF controller may provide the first driving signal Id1 to the firstcoil 1120.

The AF controller may detect displacement of the AF movable portionbased on the detected signal Ps received from the detector 1241 of thelens moving apparatus 1100 and control displacement of the AF movableportion according to the result of detection.

In another embodiment, the detector 1241 of the lens moving apparatus1100 may be omitted, the AF controller may include the detector 1241 ofthe lens moving apparatus 1100, and the AF controller may include theembodiments 1241 a and 1241 b described in FIG. 27 or 28.

In addition, the OIS controller may be electrically connected to theposition sensors 240 a and 240 b and the OIS coils 1230-1 to 1230-4 ofthe third coil 1230.

The OIS controller may provide the driving signal to the OIS coils1230-1 to 1230-4, detect displacement of the OIS movable portion basedon outputs received from the position sensors 240 a and 240 b, andperform OIS feedback control of the OIS movable portion according to theresult of detection. At this time, the OIS movable portion may includethe AF movable portion and elements mounted in the housing 1140.

The connector 840 may be electrically connected to the second holder 800and may include a port for conductible connection with an externaldevice.

Instead of the capacitor described in FIG. 33 being disposed on thecircuit board 1250 of the lens moving apparatus 1100, in order to removePWM noise, the camera module 200-1 may further include a capacitordisposed in the second holder 800 and electrically connected to bothends of each of the first and second sensing coils 1171 and 1172.

FIG. 34 is a perspective view of a lens moving apparatus 3100 accordingto an embodiment, FIG. 35 is an exploded perspective view of the lensmoving apparatus 3100 shown in FIG. 34, and FIG. 36 is an assembledperspective view of the lens moving apparatus 3100 of FIG. 34 except fora cover 3300.

Referring to FIGS. 34 to 36, the lens moving apparatus 3100 includes acover member 3300, a bobbin 3110, a first coil 3120, a magnet 3130, ahousing 3140, an upper elastic member 3150, a lower elastic member 3160,a base 3310, a plurality of supporting members 3220 and a circuit board3250.

The lens moving apparatus 3100 may include a third coil 3230 interactingwith the magnet 3130 for handshake correction. In addition, the lensmoving apparatus 3100 may further include a position sensor 3240 forfeedback OIS operation. A description of the cover member 300 of FIG. 1or the cover member 1300 of FIG. 16 is applicable to the cover member3300.

Next, the bobbin 3110 will be described.

The bobbin 3110 may be disposed inside the housing 3140 and may be movedin a first direction, e.g., a z-axis direction, by electromagneticinteraction between the first coil 3120 and the magnet 3130.

For example, when the driving signal, e.g., driving current, is suppliedto the first coil 3120, the bobbin 3110 may rise from an initialposition and, when supply of the driving signal is stopped, the bobbin3120 falls, thereby implementing an autofocus function.

In addition, for example, when forward driving current is applied, thebobbin 3110 may be moved upward from the initial position and, whenbackward current is applied, the bobbin 3110 may be moved downward fromthe initial position.

The bobbin 3110 may have a hollowness in which the lens or the lensbarrel will be mounted. The shape of the hollowness may be circular,elliptical or polygonal without being limited thereto.

Although not shown, the bobbin 3110 may include a lens barrel (notshown) in which at least one lens is installed. The lens barrel may becoupled to the inside of the bobbin 110 in various manners.

FIG. 37a is a first perspective view of the bobbin 3110 and the firstcoil 3120 shown in FIG. 34, and FIG. 37b is a second perspective view ofthe bobbin 3110 and the first coil 3120 shown in FIG. 34.

Referring to FIGS. 37a and 37b , the bobbin 3110 may include a firstprotrusion 3111 protruding from the upper surface thereof in a firstdirection and a second protrusion 3112 protruding from the outercircumferential surface of the bobbin 3110 in a second direction and/ora third direction.

The first protrusion 3111 of the bobbin 3110 may include a guide portion3111 a and a first stopper 3111 b. The guide portion 3111 a of thebobbin 3110 may serve to guide the installation position of the upperelastic member 3150. For example, the guide portion 311 a of the bobbin3110 may guide a first frame connector 3153 of the upper elastic member3150.

The second protrusion 3112 of the bobbin 3110 may protrude from theouter circumferential surface of the bobbin 3110 in the second directionand/or the third direction perpendicular to the first direction.

In addition, a first upper supporting projection 3113 engaged with athrough-hole 3151 a of a first inner frame 3151 of the upper elasticmember 3150 may be provided on the upper surface of the bobbin 3110.

The first stopper 3111 b and the second protrusion 3111 b of the bobbin3110 may serve to inhibit the upper surface of the bobbin 3110 fromdirectly colliding with the inside of the cover member 3300 even whenthe bobbin 3110 moves beyond a prescribed range by external impact inthe case where the bobbin 3110 moves in the first direction for theautofocus function.

The bobbin 3110 may include a first lower supporting projection 3117formed on a lower surface thereof to be engaged with and fixed to thethrough-hole 3161 a of the lower elastic member 3160.

The bobbin 3110 may include a second stopper 3116 protruding from thelower surface thereof. The second stopper 3116 may serve to inhibit thelower surface of the bobbin 3110 from directly colliding with the base3210, the third coil 3230 or the circuit board 3250 even when the bobbin3110 moves beyond a prescribed range by external impact in the casewhere the bobbin 3110 moves in the first direction for the autofocusfunction.

The outer circumferential surface 3110 b of the bobbin 3110 may includefirst side portions 3110 b-1 and second side portions 3110 b-2 locatedbetween the first side portions 3110 b-1.

The first side portions 3110 b-1 of the bobbin 3110 may correspond to orbe opposite to the magnet 3130. Each of the second side portions 3110-bof the bobbin 3110 may be disposed between two adjacent first sideportions.

The outer circumferential surface of each of the first side portions3110 b-1 of the bobbin 3110 may be planar and the outer circumferentialsurface of each of the second side portions 3110 b-2 may be curved,without being limited thereto.

The bobbin 3110 may include at least one first coil groove (not shown),in which the first coil 3120 is disposed or installed, in the outercircumferential surface 3110 b thereof. For example, the first coilgroove may be provided in the first side portions and the second sideportions of the bobbin 3110. The shape and number of first coil groovesmay correspond to the shape and number of first coils 3120 disposed onthe outer circumferential surface 3110 b of the bobbin 3110. In anotherembodiment, the bobbin 3110 may not include the first coil groove andthe first coil 3120 may be directly wound on and fixed to the outercircumferential surface of the bobbin 3110.

Next, the first coil 3120 will be described.

The first coil 3120 may be disposed on the outer circumferential surface3110 b of the bobbin 3110, and may be a driving coil for performingelectromagnetic interaction with the magnet 1330 disposed in the housing3140.

In order to generate electromagnetic force by interaction with themagnet 3130, a driving signal (e.g., driving current or voltage) may beapplied to the first coil 3120.

The driving signal applied to the first coil 3120 may be an AC signal(e.g., AC current). For example, the driving signal provided to thefirst coil 3120 may be a sine wave signal or a pulse signal (e.g., apulse width modulation (PWM) signal).

In another embodiment, the driving signal applied to the first coil 3120may include an AC signal and a DC signal.

By electromagnetic force due to interaction between the first coil 3120and the magnet 3130, an AF movable portion may move in the firstdirection.

By controlling the driving signal applied to the first coil 3120 tocontrol electromagnetic force due to interaction between the first coil3120 and the magnet 3130, it is possible to control movement of the AFmovable portion in the first direction and thus to perform an autofocusfunction.

The AF movable portion may include the bobbin 3110 elastically supportedby upper and lower elastic members 3150 and 3160 and elements installedin the bobbin 110 to move along with the bobbin 3110. For example, theAF movable portion may include the bobbin 3110, the first coil 3120, anda lens (not shown) installed in the bobbin 3110.

The first coil 3120 may be wound to surround the outer circumferentialsurface of the bobbin 3110 to rotate clockwise or counterclockwise aboutan optical axis. In another embodiment, the first coil 3120 may beimplemented in a coil ring shape wound clockwise or counterclockwiseabout an axis perpendicular to the optical axis, e.g., a coil ringshape, and the number of coil rings may be equal to the number ofmagnets 3130, without being limited thereto.

The first coil 3120 may be electrically connected to at least one of theupper or lower elastic member 3150 or 3160 and may be electricallyconnected to the circuit board 3250 through the upper or lower elasticmember 3150 or 3160 and the supporting members 3220.

The housing 3140 receives the bobbin 3110, in which the first coil 3120is disposed, and supports the magnet 3130.

FIG. 38a is a first perspective view of the housing 3140 shown in FIG.34, FIG. 38b is a second perspective view of the housing 3140 shown inFIG. 34, and FIG. 39 is a cross-sectional view of the lens movingapparatus 3100 shown in FIG. 36 taken along line A-B.

Referring to FIGS. 38a, 38b and 39, the housing 3140 may have a hollowpillar shape and may include the plurality of side portions 3141 andsecond side portions 3142 forming the hollowness.

For example, the housing 3140 may include the first side portions 3141spaced apart from each other and the second side portions 3142 spacedapart from each other. Each of the first side portions 3141 of thehousing 3140 may be disposed or located between two adjacent second sideportions 3142 to connect the second side portions 3142 to each other,and may include a plane having a certain depth.

The magnet 3130 may be disposed or installed on the first side portions3141 of the housing 3140, and a supporting member 3220 may be disposedon the second side portions 3142 of the housing 3140.

The housing 3140 may include a magnet seating portion 3141 a provided inthe inner surfaces of the first side portions 3141 in order to supportor receive the magnets 3130-1 to 3130-4.

The first side portions 3141 of the housing 3140 may be disposed inparallel to the side plate of the cover member 3300. A through-hole 3147a, through which the supporting member 3220 passes, may be provided inthe second side portions 3142 of the housing 3140.

In addition, a second stopper 3144 may be provided on the upper surfaceof the housing 3140, in order to inhibit direct collision with the innersurface of the cover member 3300.

The housing 3140 may include at least one second upper supportingprojection 3143 on the upper surfaces of the second side portions 3142,for engagement with the through-hole 3152 a of the first outer frame3152 of the upper elastic member 3150, and second lower supportingprojections 3145 on the lower surfaces of the second side portions 3142,for engagement with and fixing to the through-hole 3162 a of the secondouter frame 3162 of the lower elastic member 3160.

In order not only to secure a passage, through which the supportingmember 3220 passes, but also to secure a space filled with siliconcapable of damping, the housing 3140 may include grooves 3142 a providedin the second side portions 3142. For example, the grooves 3142 a of thehousing 3140 may be filled with damping silicon.

The housing 3140 may include third stoppers 3149 protruding from theside surfaces of the first side portions 3141. The third stoppers 3149may inhibit the housing 3140 from colliding with the inner surface ofthe side plate of the cover member 3300 when the housing 3140 moves inthe second and third directions.

The housing 3140 may further include a fourth stopper (not shown)protruding from the lower surface thereof, in order to inhibit thebottom surface of the housing 3140 from colliding with the base 3210,the third coil 3230 and/or the circuit board 3250.

The magnets 3130-1 to 3130-4 are received in the first side portions3141 of the housing 3140, without being limited thereto. In anotherembodiment, the magnets 3130-1 to 3130-4 may be disposed outside thefirst side portions 3141 of the housing 3140.

The magnet 3130 may be disposed on the first side portions 3141 of thehousing 3140 to correspond to or to be aligned with the first coil 3120in a direction perpendicular to the optical axis direction.

For example, the magnets 3130-1 to 3130-4 disposed in the housing 3130may overlap the first coil 3120 in the direction perpendicular to theoptical axis, for example, in the second or third direction, at theinitial position of the AF movable portion (e.g., the initial positionof the bobbin 3110). The initial position of the AF movable portion maybe equal to that described in the embodiment of FIG. 1.

In another embodiment, the first side portions 3141 of the housing 3140are not provided with the magnet seating portion 3141 a, and the magnet3130 may be disposed on any one of the outside or inside of the firstside portions 3141 of the housing 3140.

The magnet 3130 may have a shape corresponding to the shape of the firstside portions 3141 of the housing 3140, e.g., a rectangularparallelepiped shape, without being limited thereto.

The magnet 3130 may be a unipolar magnet or a bipolar magnet having anS-pole surface opposite to the first coil 3120 and an N-pole outersurface thereof. However, the embodiment is not limited thereto and theS- and N-poles may be reversely disposed.

In the embodiment, the number of magnets 3130 is 4, but the embodimentis not limited thereto and the number of magnets 3130 may be at leasttwo. The surface of the magnet 3130 opposite to the first coil 3120 maybe planar, but the embodiment is not limited thereto and the surface ofthe magnet 3130 opposite to the first coil 3120 may be curved.

Next, the upper elastic member 3150 and the lower elastic member 3160will be described.

The upper elastic member 3150 and the lower elastic member 3160 may becoupled with the bobbin 3110 and the housing 3140 to flexibly supportthe bobbin 3110.

FIG. 40 is an assembled perspective view of the upper elastic member3150, the lower elastic member 3160, the supporting member 3220, thethird coil 3230, the circuit board 3250 and the base 3210 of FIG. 35.

Referring to FIG. 40, the upper elastic member 3150 and the lowerelastic member 3160 may be coupled to the bobbin 3110 and the housing3140 to flexibly support the bobbin 3110.

For example, the upper elastic member 3150 may be coupled to the upperportion, the upper surface or the upper end of the bobbin 3110 and theupper portion, the upper surface or the upper end of the housing 3140,and the lower elastic member 3160 may be coupled to the lower portion,the lower surface or the lower end of the bobbin 3110 and the lowerportion, the lower surface or the lower end of the housing 3140.

At least one of the upper and lower elastic members 3150 and 3160 may bedivided into two or more.

For example, the upper elastic member 3150 may include first to fourthupper springs 3150-1 to 3150-4 spaced apart from each other.

The upper elastic member 3150 and the lower elastic member 3160 may beimplemented as a leaf spring without being limited thereto and may beimplemented as a coil spring, a suspension wire, etc.

Each of the first to fourth upper springs 3150-1 to 3150-4 may includean inner frame 3151 coupled to the upper portion, the upper surface orthe upper end of the bobbin 3110, a first outer frame 3152 coupled tothe upper portion, the upper surface or the upper end of the housing3140, and a first frame connector 3153 connecting the first inner frame3151 with the first outer frame 3152.

The outer frame 3152 of each of the first to fourth upper springs 3150-1to 3150-4 may include a first coupler 3510 coupled to the housing 3140,a second coupler 3520 coupled to the supporting members 3220-1 to 3220-4and a connector 3530 connecting the first coupler 3510 with the secondcoupler 3520.

The lower elastic member 3160 may include a second inner frame 3161coupled to the lower portion, the lower surface or the lower end of thebobbin 3110, a second outer frame 3162 coupled to the lower portion, thelower surface or the lower end of the housing 3140 and a second frameconnector 3163 connecting the second inner frame 3161 with the secondouter frame 3162.

Each of the first and second frame connectors 3153 and 3163 of the upperand lower elastic members 3150 and 3160 may be bent or curved at leastone time to form a predetermined pattern. Rising and falling operationof the bobbin 3110 in the first direction may be flexibly supportedthrough positional change and microdeformation of the first and secondframe connectors 3153 and 3163.

For example, one end of the first coil 3120 may be bonded to the firstinner frame 3151 of any one (e.g., 3150-1) of the upper springs 3150-1to 3150-4 and the other end of the first coil 3120 may be bonded to thefirst inner frame 3151 of another (e.g., 3150-2) of the upper springs3150-1 to 3150-4.

For example, the first connector connected to the first coil 3120 may beprovided on the first inner frame 3151 of each of the first to secondupper springs 3150-1 to 3150-2 by soldering or a conductive adhesivemember.

Each of the first to fourth upper springs 3150-1 to 3150-4 may include athrough-hole 3151 a disposed in the first inner frame 3151 and engagedwith the first upper supporting projection 3113 of the bobbin 3110 and athrough-hole 3152 a disposed in the first outer frame 3152 and engagedwith the second upper supporting projection 3143 of the housing 3140.

In addition, the lower elastic member 3160 may include a through-hole3161 a disposed in the second inner frame 3161 and engaged with thefirst lower supporting projection 3117 of the bobbin 3110 and athrough-hole 3162 a disposed in the second outer frame 3162 and engagedwith the second lower supporting projection 3145 of the housing 3140.

In order to absorb and damp vibration of the bobbin 3110, the lensmoving apparatus 3100 may further include a first damping member (notshown) disposed between each of the upper springs 3150-1 to 3150-4 andthe housing 3140.

For example, the first damping member (not shown) may be disposed in aspace between the first frame connector 3153 of each of the uppersprings 3150-1 to 3150-4 and the housing 3140.

In addition, for example, the lens moving apparatus 3100 may furtherinclude a second damping member (not shown) disposed between the secondframe connector 3163 of the lower elastic member 3160 and the housing3140.

In addition, for example, a damping member (not shown) may be furtherdisposed between the inner surface of the housing 3140 and the outercircumferential surface of the bobbin 3110.

By two electrically disconnected upper springs and the supportingmembers corresponding thereto, the circuit board 3250 and the first coil3120 may be electrically connected and the driving signal may beprovided from the circuit board 3250 to the first coil 3120. However,the embodiment is not limited thereto.

In another embodiment, the role of the plurality of upper springs andthe role of the lower elastic member 160 may be interchanged. That is,the lower elastic member 160 may be divided into a plurality of lowerelastic members and the circuit board 3250 and the first coil 3120 maybe electrically connected using two electrically disconnected lowerelastic members.

Next, the supporting member 3230 will be described.

A plurality of supporting members 3220 may be provided and the pluralityof supporting members 3220-1 to 3220-4 may be located to correspond tothe second side portions 3142 of the housing 3140, and may support thebobbin 3110 and the housing 3140 such that the bobbin 3110 and thehousing 3140 are moved in the direction perpendicular to the firstdirection.

For example, each of the plurality of supporting members 3220-1 to3220-4 may be disposed adjacent to any one of the four second sideportions 3142.

Although one supporting member is disposed on each of the second sideportions 3142 of the housing 3140 in FIG. 40, the embodiment is notlimited thereto.

In another embodiment, two or more supporting members may be disposed oneach of the second side portions of the housing 3140 and the upperelastic member 3150 may include two or more upper springs disposed on atleast one of the second side portions of the housing 3140. For example,two supporting members disposed on any one second side portion of thehousing 3140 may be connected to any one of two upper springs separatedfrom each other and disposed on the second side portion.

One end of each of the supporting members 3220-1 to 3220-4 may be bondedto the outer frames 3152 of the upper elastic members 3150-1 to 3150-4disposed on the corresponding second side portion, by an adhesive member3901 or a solder. The plurality of supporting members 3220-1 to 3220-4may be spaced apart from the housing 3140 and may not be fixed to thehousing 3140 but may be directly connected to the connectors 3530 of theouter frames 3153 of the upper springs 3150-1 to 3150-4.

In another embodiment, the supporting member 3220 may be disposed on thefirst side portions 3141 of the housing 3140 in the form of a leafspring.

The plurality of supporting members 3220-1 to 3220-4 and the uppersprings 3150-1 to 3150-4 may transmit the driving signal from thecircuit board 3250 to the first coil 3120.

The plurality of supporting members 3220-1 to 3220-4 may be formedseparately from the upper elastic member 3150, and may be implemented asan elastically supportable member, e.g., a leaf spring, a coil spring ora suspension wire. In addition, in another embodiment, the supportingmembers 3220-1 to 3220-4 may be formed integrally with the upper elasticmember 3150.

Next, the base 3210, the third coil 3230, the position sensor 240 andthe circuit board 250 will be described.

FIG. 41 is an exploded perspective view of the third coil 3230, thecircuit board 3250, the base 3210 and first and second OIS positionsensors 3240 a and 3240 b.

Referring to FIG. 41, the base 3210 may be coupled with the cover member3300 to form a reception space between the bobbin 3110 and the housing3140. The base 3210 may include a hollowness corresponding to thehollowness of the bobbin 3110 and/or the hollowness of the housing 3140,and have a shape matching or corresponding to that of the cover member3300, e.g., a rectangular shape.

The base 3210 may include a stair 3211 coated with an adhesive when thecover member 3300 is adhered and fixed. At this time, the stair 3211 mayguide the cover member 330 coupled to the upper side thereof and the endof the side plate of the cover member 330 may be coupled to be insurface contact.

The stair 3211 of the base 3210 and the end of the side plate of thecover member 3300 may be adhered or fixed by an adhesive.

A supporting portion 3255 may be formed in the surface of the base 3210opposite to the terminal member 3253 on which the terminal 3251 of thecircuit board 3250 is formed. The supporting portion 3255 of the base3210 may be formed as a cross section from the outer surface 3210without a stair, protrude from the lower surface of the base 3210, andsupport the terminal member 3253 of the circuit board 3250.

The corner of the base 3210 may have a second groove 3212. If the cornerof the cover member 3300 protrudes, the protrusion of the cover member3300 may be coupled to the base 210 at the second groove 3212.

In addition, seating grooves 3215-1 and 3215-2 in which the positionsensors 3240 may be disposed may be provided in the upper surface of thebase 3210. In some embodiments, two seating grooves 3215-1 and 3215-2may be provided in the upper surface of the base 3210 and the positionsensors 3240 may be disposed in the seating grooves 3215-1 and 3215-2 ofthe base 3210, thereby detecting displacement of the housing 3140 in thedirection perpendicular to the optical axis, e.g., the second directionand the third direction. Virtual lines connecting the centers of seatinggrooves 3215-1 and 3215-2 of the base 3210 and the center of the base3210 may cross each other. For example, the angle between the virtualangles may be 90°, without being limited thereto.

For example, the seating grooves 3215-1 and 3215-2 of the base 3210 maybe disposed to be aligned at or near the center of the third coil 3230,without being limited thereto. Alternatively, the center of the thirdcoil 3230 and the center of the position sensor 3240 may be aligned witheach other, without being limited thereto.

The position sensor 3240 may detect displacement of the housing 3140relative to the base 3210 in the direction perpendicular to the opticalaxis OA (e.g., the X-axis or Y-axis).

The position sensor 3240 may include two OIS position sensors 3240 a and3240 b disposed to cross each other or to be perpendicular to each otherin order to detect displacement of the housing 3140 in the directionperpendicular to the optical axis OA.

The third coil 3230 is disposed on the upper surface of the circuitboard 3250 to correspond to or to be aligned with the magnet 3130. Thenumber of third coils 3230 may be one or more and may be equal to thenumber of magnets 3130, without being limited thereto.

Although the third coil 3230 is provided on a circuit member 3231separately from the circuit board 3250 in FIG. 41, the embodiment is notlimited thereto. In another embodiment, the third coil 3230 may beimplemented in the form of a ring-shaped coil block, an FP coil or acircuit pattern formed on the circuit board 3250.

The circuit member 231 on which the third coil 3230 is provided mayinclude through-holes 3230 a, through the supporting members 3220 pass.

The third coil 3230 is disposed on the circuit board 3250 to be oppositeto the magnets 3130 disposed on or fixed to the housing 3140.

For example, the third coil 3230 may include a plurality of opticalimage stabilization (OIS) coils 3230-1 to 3230-4 corresponding to theplurality of magnets 3130-1 to 3130-4.

Each of the plurality of OIS coils 3230-1 to 3230-4 may correspond to orbe aligned with any one of the plurality of magnets 3130-1 to 3130-4 inthe first direction.

For example, the plurality of OIS coils 230-1 to 230-4 may be disposedin correspondence with four sides of the circuit board 250, withoutbeing limited thereto.

The OIS coils 230-1 to 230-4 may be electrically connected to thecircuit board 1250. The driving signal may be provided from the circuitboard 3250 to the plurality of OIS coils 3230-1 to 3230-4. At this time,the driving signal may be an AC signal (e.g., AC current) or a DC signal(e.g., DC current). For example, the driving signal provided to theplurality of OIS coils 3230-1 to 3230-4 may be a sine wave signal or apulse signal (e.g., a pulse width modulation (PWM) signal).

In another embodiment, the driving signal provided to the plurality ofOIS coils 3230-1 to 3230-4 may be an AC signal and a DC signal.

Although the third coil 3230 includes two OIS coils 3230-3 and 3230-4for the second direction and two OIS coils 3230-3 and 3230-4 for thethird direction in FIG. 41, the embodiment is not limited thereto. Inanother embodiment, the second coil may include one or more OIS coilsfor the second direction and one or more OIS coils for the thirddirection.

Electromagnetic force may be generated by interaction between themagnets 3130-1 to 3130-4 and the plurality of OIS coils 3230-1 to 3230-4disposed to be opposite to each other, and the housing 3140 may moveusing such electromagnetic force in the direction perpendicular to theoptical axis, e.g., the second direction and/or the third direction,thereby performing handshake correction.

Each of the OIS position sensors 3240 a and 3240 b may be a Hall sensorand any sensor capable of detecting the strength of the magnetic fieldmay be used. For example, each of the OIS position sensors 3240 a and3240 b may be implemented as a driver including a Hall sensor or may beimplemented as a position detection sensor such as a Hall sensor alone.

The third coil 3230 may be disposed at the upper side of the circuitboard 3250 and the first and second OIS position sensors 3240 a and 3240b may be disposed at the lower side of the circuit board 3250.

The circuit board 3250 may be disposed on the upper surface of the base3210 and may include a hollowness corresponding to a hollowness of thebobbin 3110, a hollowness of the housing 140, and/or a hollowness of thebase 210.

The circuit board 3250 may include at least one terminal surface 3253bent from the upper surface thereof and a plurality of terminals 3251provided on the terminal surface 3253. For example, the circuit board3250 may have the terminals provided on any two opposite sides of theupper surface thereof, without being limited thereto.

For example, external power may be received through the plurality ofterminals 3251 provided on the terminal member 3253 of the circuit board3250, a driving signal or power may be supplied to the first and thirdcoils 3120 and 3230 and the first and second OIS position sensors 3240 aand 3240 b, and output signals output from the first and second OISposition sensors 3240 a and 3240 b may be output to the outside.

The circuit board 3250 may be a flexible printed circuit board (FPCB)without being limited thereto and the terminal of the circuit board 3250may be configured on the surface of the base 210 or a PCB using asurface electrode method.

The circuit board 3250 may include through-holes 3250 a 1 and 3250 a 2,through which the supporting members 3220-1 to 3220-4 pass. Thesupporting members 3220-1 to 3220-4 may be electrically connected to acircuit pattern formed on the lower surface of the circuit board 3250through the through-holes 3250 a 1 and 3250 a 2 of the circuit board3250 using soldering.

In addition, in another embodiment, the circuit board 3250 may notinclude the through-holes 3250 a 1 and 3250 a 2, and the supportingmembers 3220-1 to 3220-4 may be electrically connected to the circuitpattern or the pad formed on the upper surface of the circuit board 3250through soldering.

The circuit board 3250 may further include a through-hole 3250 b engagedwith and fixed to the projection 3217 of the base 3210 through thermalfusion or an adhesive member.

By soldering or a conductive adhesive member, one end of the supportingmember 3220 may be coupled to the upper elastic member 3150 and theother end of the supporting member 3220 may be coupled to the circuitboard 3250, the circuit member 3231 and/or the base 3210.

The lens moving apparatus 3100 according to the embodiment shown inFIGS. 34 to 41 may further include an AF position sensor and a sensingmagnet for AF feedback operation.

FIG. 42 is a cross-sectional view of a lens moving apparatus 3100-1according to another embodiment.

Referring to FIG. 42, the embodiment 3100-1 may further include an AFposition sensor 3170 and a sensing magnet 3190 in addition to the lensmoving apparatus 3100.

The sensing magnet 3190 may be disposed in the bobbin 3110 to be spacedapart from the first coil 3120. For example, the sensing magnet 3190 maybe disposed on the first coil 3120.

The AF position sensor 3170 may be disposed in the housing 3140 incorrespondence with the sensing magnet 3190. For example, the AFposition sensor 3170 may overlap the sensing magnet 3190 in thedirection perpendicular to the optical axis.

The AF position sensor 3170 may detect the strength of the magneticfield of the sensing magnet 3190 according to movement of the bobbin3110, and generate an output signal, e.g., an output voltage, accordingto the result of detection. Using the output signal of the AF positionsensor 3170, displacement of the bobbin 3110 in the optical axis OAdirection may be controlled.

The AF position sensor 3170 may be implemented as a driver including aHall sensor or may be implemented as a position detection sensor such asa Hall sensor alone.

The AF position sensor 3170 may be electrically connected to at leastone of the upper elastic member 3150 or the lower elastic member 3160,may be electrically connected to the circuit board through thesupporting members, may receive the driving signal from the circuitboard 3250, and may transmit the output signal of the AF position sensor3170 to the circuit board.

FIG. 43 is a cross-sectional view of a lens moving apparatus 3100-2according to another embodiment.

Referring to FIG. 43, the lens moving apparatus 3100-2 is a modifiedexample of FIG. 42, the sensing magnet 3190 is disposed in the housing3140 and the AF position sensor 3170 is disposed in the bobbin 3110. Forexample, the sensing magnet 3190 may be disposed in the housing 3140 tobe spaced apart from the magnet 3130-1, and the AF position sensor 3170may be disposed in the bobbin 3110 to be spaced apart from the firstcoil 3120.

In another embodiment, the sensing magnet 3190 of FIG. 43 may beomitted, and the AF position sensor 3170 may generate the output signalaccording to the result of detecting the magnetic field of the magnet3130 according to movement of the bobbin 3110.

FIG. 44 is a first bottom perspective view of a circuit board 3250according to an embodiment, FIG. 45 is a second bottom perspective viewof the circuit board 3250 shown in FIG. 44, FIG. 46 is a partiallyenlarged view of a terminal member 3253 shown in FIG. 44, and FIG. 47 isa cross-sectional view of the terminal member 3253 shown in FIG. 44taken along line A-B.

Referring to FIGS. 44 to 47, the circuit board 3250 includes a body 3250a having a hollowness and disposed on the upper surface of the base3210, at least one terminal member 3253 bent to the side surface of thebase 3210, at least one connection terminal 3251-1 to 3251-n (n being anatural number greater than 1) disposed on the front surface 3025-1 ofthe terminal member 3253, and at least one dummy terminal 3259-1 to3259-n (n being a natural number greater than 1) disposed on the backsurface 3025-2 of the terminal member 3253.

The connection terminals 3251-1 to 3251-n may be electrically connectedto the first and third coils 3120 and 3240 and the first and second OISposition sensors 3240 a and 3240 b. In the embodiment having the AFposition sensor, the connection terminals 3251-1 to 3251-n may beelectrically connected to the AF position sensor 3170 of FIGS. 42 and43.

The circuit board 3250 may include a first insulating layer 3601, afirst conductive layer 3602 a disposed on the upper surface of the firstinsulating layer 3601, a second insulating layer 3603 a disposed on thefirst conductive layer 3602 a, a second conductive layer 3602 b disposedon the lower surface of the first insulating layer 3601, and a thirdinsulating layer 3603 a disposed below the second conductive layer 3602b.

The first conductive layer 3602 a may be a patterned metal layer, e.g.,a Cu plating layer. For example, the first conductive layer 3602 a maybe patterned to include the supporting members 3220-1 to 3220-6, thethird coil 3230, and wires and pads electrically connected to the secondposition sensor 3240.

The connection terminals 3251-1 to 3251-n of the circuit board 3250 areregions of the first conductive layer 3602 exposed from the secondinsulating layer 3602 a, and the first conductive layer 3602 a may beelectrically connected to any one of the supporting members 3220-1 to3220-6, the third coil 3230, and the second position sensor 3240.

The first insulating layer 3601 may be formed of resin, e.g., polyimide,without being limited thereto.

The second conductive layer 3602 b may be a metal layer, e.g., a Culayer, patterned to correspond to the connection terminals 3251-1 to3251-n.

The dummy terminals 3259-1 to 3259-n of the circuit board 3250 are theregions of the second conductive layer 3602 b exposed to the thirdinsulating layer 3602 and may be spaced apart and electricallydisconnected from each other.

In addition, the dummy terminals 3259-1 to 3259-n of the circuit board3250 may be disposed to be spaced apart from the connection terminals3251-1 to 3251-n.

The connection terminals 3251-1 to 3251-n of the terminal member 3253 ofthe lens moving apparatus 3100 may be electrically connected to the padof the camera module by soldering. However, since the solder is noteasily adhered to the insulating member 3601 of the terminal member3253, solderability between the connection terminals 3251-1 to 3251-nand the pad of the camera module is not good and thus bonding strengththerebetween may be poor and connection failure may occur.

The dummy terminals 3259-1 to 3259-n may serve to inhibit the bondingstrength from being weakened and connection failure from occurring, byimproving solderability of the connection terminals 3251-1 to 3251-n.

The plurality of connection terminals 3251-1 to 3251-n may be arrangedin a line on the front surface 3025-1 of the terminal member 3253 in thedirection parallel to the terminal member 3253, without being limitedthereto. For example, the plurality of connection terminals 3251-1 to3251-n may be arranged in a line in the longitudinal direction 3301 ofthe terminal member 3253.

In order to improve solderability with the camera module, one end ofeach of the plurality of connection terminals 3251-1 to 3251-n may be incontact with one end of the front surface 3025-1 of the terminal member3253. For example, one end of the connection terminal 3253 may be incontact with one end of the insulating member 3601.

Each of the plurality of dummy terminals 3259-1 to 3259-n may be locatedto be aligned with any one of the plurality of connection terminals3251-1 to 3251-n in the direction perpendicular to the front surface3025-1 of the terminal member 3253.

For example, a virtual center line bisecting the connection terminal anda second virtual center line bisecting the dummy terminals may bealigned with or overlap each other in the direction perpendicular to thefront surface 3025-1 of the terminal member 3253.

For example, the plurality of dummy terminals 3259-1 to 3259-n may bearranged in a line on the back surface 3025-2 of the terminal member3253 in the direction parallel to the terminal member 3253, withoutbeing limited thereto. For example, the plurality of dummy terminals3259-1 to 3259-n may be arranged in a line in the longitudinal direction3301 of the terminal member 3253.

In order to improve solderability of the connection terminals 3251-1 to3251-n, at least some of the dummy terminals 3259-1 to 3259-n mayoverlap the connection terminals in the direction perpendicular to thefront surface 3025-1 of the terminal member 253.

In order to improve solderability of the connection terminals 3251-1 to3251-n, one end of each of the dummy terminals 3259-1 to 3259-n may bein contact with one end of the back surface 3025-2 of the terminalmember 3253. For example, one end of the dummy terminal may be incontact with one end 3601 a of the first insulating layer 3601 of theterminal member 3253.

The area of each of the dummy terminals 3259-1 to 3259-n may be lessthan that of each of the connection terminals 3251-1 to 3251-n.

Since the connection terminals 3251-1 to 3251-n are electricallyconnected by soldering, a certain area is required. However, since thedummy terminals 3259-1 to 3259-n are provided for improvedsolderability, not for conductible connection, the area of the dummyterminals does not need to be equal to the area of the connectionterminals. Further, if the area of each of the dummy terminals 3259-1 to3259-n is greater than that of each of the connection terminals 3251-1to 3251-n, the thickness of the terminal member 3253 may be reduced anddurability of the terminal member 3253 may be weakened.

Referring to FIG. 46, the length L2 of the dummy terminal (e.g., 3259-3)is shorter than the length L1 of the connection terminal (e.g., 3251-3)corresponding thereto in the longitudinal direction 3301 of the terminalmember 3253 (L2<L1).

For example, the length L2 of the dummy terminal (e.g., 3259-3) may be ⅓to ½ the length L1 of the connection terminal (e.g., 3251-3). IfL2<L1/3, solderability of the connection terminals may not be improvedand, if L2>L1/2, the durability of the terminal member may be weakenedand the terminal member may be damaged.

Referring to FIGS. 44 and 45, the length H2 (see FIG. 45) of the dummyterminal (e.g., 3259-1) in the direction perpendicular to thelongitudinal direction 3301 of the terminal member 3253 is shorter thanthe length H1 of the connection terminal 3251-1 corresponding thereto(H2<H1). For example, the length H1 of the connection terminal may bethe largest value among the lengths from the upper end and the lower endthereof.

For example, the length H2 of the dummy terminal (e.g., 3259-1) may be ¼to ⅓ the length H1 of the connection terminal (e.g., 3251-1). IfH2<H1/4, solderability of the connection terminals may not be improvedand, if H2>H1/3, the durability of the terminal member 3253 may beweakened and the terminal member 3253 may be damaged.

FIG. 48 is a bottom perspective view of a base 3210 according to anembodiment, and FIG. 49 is a partially enlarged view of the base 3210 ofFIG. 48 coupled with a circuit board 3250.

Referring to FIGS. 48 and 49, grooves 3040-1 and 3040-2 opposite to thedummy terminals 3259-1 to 3259-n may be provided in the lower end of theouter surface of the base 3210.

For example, the grooves 3040-1 and 3040-2 may be provided in the lowerend of the outer surface of the supporting portion 3255 of the base3210.

A space or gap, into which a solder may permeate, may be formed betweenthe outer surface of the base 3210 and the dummy terminals 3259-1 to3259-n of the circuit board 3250 by the grooves 3040-1 and 3040-2 of thebase 3210, thereby facilitating soldering.

For example, the distance D1 between the outer surface of the base 3210and the dummy terminals 3259-1 to 3259-n of the circuit board 3250 maybe 70 μm to 80 μm.

For example, the distance D1 (see FIG. 50) between the bottom of thegroove 3040-1 of the base and the dummy terminals 3259-1 to 3259-n ofthe circuit board 3250 may be 70 μm to 80 μm.

When the distance D1 is less than 70 μm, the space, into which a soldermaterial permeates, may be insufficient and thus solderability of thedummy terminals may be deteriorated. In addition, when the distance D1exceeds 80 μm, the solder material may be spaced apart from the outersurface of the base during soldering and thus the solder material maynot be supported by the outer surface of the base, thereby deterioratingsolderability of the dummy terminals.

For example, the bottoms of the grooves 3040-1 and 3040-2 of the base3210 in the lower surface 3210 a of the base 3210 may be positioned atthe same plane as the upper ends of the dummy terminals 3259-1 to3259-n, without being limited thereto.

For example, the distance from the lower surface 3210 a of the base 3210to the bottoms of the grooves 3040-1 and 3040-2 of the base 3210 may beequal to the distance from the lower ends to the upper ends of the dummyterminals 3259-1 to 3259-n. When the distance from the lower surface3210 a of the base 3210 to the bottoms of the grooves 3040-1 and 3040-2of the base 3210 is too large, the supporting portion 3255 of the base3210 may not support the circuit board 3250 and thus the circuit board3250 may be bent.

The grooves 3040-1 and 3040-2 of the base 3210 may be disposed in thelower end of the outer surface of the supporting portion 3255 in a lineshape, without being limited thereto.

In another embodiment, the base 3210 may include a plurality of groovesspaced apart from each other, and the plurality of grooves may beprovided in the lower end of the supporting portion 3255 of the base3210 in correspondence with any one of the dummy terminals and may bearranged in a line.

The lens moving apparatus 3100 according to the embodiment may includedummy terminals corresponding to the connection terminals on theterminal member 3253 of the circuit board 3250, thereby improvingsolderability during soldering to the camera module and inhibitingconnection failure.

The camera module according to another embodiment may include the lensmoving apparatus 3100 of FIG. 34 instead of the lens moving apparatus1100 in the camera module 200 shown in FIG. 15b . At this time, thedescription of the camera module 200 of FIG. 15b except for theamplifier 310 is applicable to the camera module including the lensmoving apparatus 3100.

FIG. 50 is a view showing a solder 3609 disposed between a terminalmember 3253 of a lens moving apparatus 3100 according to an embodimentand a pad 801 of a second holder 800 of a camera module including thesame.

Referring to FIG. 50, during the soldering process between the terminalmember 253 of the circuit board 250 of the lens moving apparatus 3100and the pad 801 of the second holder 800 of the camera module, thesolder may be fully adhered to the dummy terminal (e.g., 3259-6) and theconnection terminal (e.g., 3251-6) corresponding thereto. That is, thesolder 3609 may be in contact with both the dummy terminal (e.g.,3259-6) and the connection terminal (e.g., 3251-6) correspondingthereto.

In addition, a portion of the solder 3609 may be located between thedummy terminal (e.g., 3259-6) and the outer surface of the base 3210.

For example, a portion of the solder 3609 may be located inside thegrooves 3040-1 and 3040-2 of the base 3210 and may be in contact withthe bottoms and/or the side walls of the grooves 3040-1 and 3040-2.

The solder material having high viscosity may easily remain between thedistal end of the insulating member 3601 and the pad 801, such that theembodiment can improve solderability between the connection terminalsand the pad and inhibit connection failure and bonding strengthweakening.

The camera module 3200 may further include an adhesive member 3013disposed between the lower surface of the circuit board and the base3210. For example, the adhesive member 3013 may be formed of a resinmaterial such as epoxy, without being limited thereto.

For example, the adhesive member 3013 may include a first adhesivemember 3013 a disposed between the back surface of the terminal member3253 of the circuit board 3250 and the outer surface of the base 3210and a second adhesive member 3013 a disposed between the lower surfaceof the circuit board 3250 and the upper surface of the base 3210.

For example, the first adhesive member 3013 may be located on a portionof the solder 3609 located inside the grooves 3040-1 and 3040-2 of thebase 3210.

In the lens moving apparatus 3100 including the AF position sensor, thecontroller 830 may further include a third driver for providing a thirddriving signal for driving the AF position sensor 3170 and a thirdamplifier for amplifying the output signal of the first position sensor3170 and outputting an amplified signal according to the result ofamplification. In addition, a servo controller may output a firstcontrol signal for controlling the AF driver based on the rotationangular speed information received from the motion sensor 820 and theamplified signal of the third amplifier and perform AF feedbackoperation.

The description of FIGS. 44 to 49 is applicable to the lens movingapparatus 100 of FIG. 1 and the lens moving apparatus 1100 of FIG. 16.

FIG. 51 is a block diagram showing an embodiment of the image sensor 810shown in FIGS. 15b and 29.

Referring to FIG. 51, the image sensor 810 includes a sensing controller905, a pixel array 910, and an analog-to-digital converting block 920.

The sensing controller 905 outputs control signals (e.g., a reset signalRX, a transmission signal TX and a selection signal SX) for controllingthe transistors included in the pixel array 120, and control signals Scfor controlling the analog-to-digital converting block 920.

The pixel array 910 includes a plurality of unit pixels P11 to Pnm (nand m being natural numbers greater than 1), and the plurality of unitpixels P11 to Pnm may be arranged in a matrix including rows andcolumns. Each of the unit pixels P11 to Pnm may be a photoelectricconversion element for detecting and converting light into an electricalsignal.

The pixel array 120 may include sensing lines connected to the outputterminals of the unit pixels P11 to Pnm.

For example, each of the unit pixels P11 to Pnm may include aphotodiode, a transfer transistor, a reset transistor, a drivetransistor and a select transistor, without being limited thereto. Thenumber of transistors included in the unit pixel is not limited to 4 andmay be 3 or 5.

The photodiode may absorb light and generate charges by the absorbedlight.

The transfer transistor may transmit the charges generated by thephotodiode to a detecting node (e.g., a floating diffusion region) inresponse to the transmission signal Tx. The reset transistor may resetthe unit pixel in response to the reset signal RX. The drive transistormay be controlled in response to the voltage of the detecting node, maybe implemented as a source follower, and may serve as a buffer. Theselect transistor may be controlled by the select signal SE and thedetected signal Va may be output through the output terminal of the unitpixel.

The analog-to-digital converting block 920 samples the detected signalVa which is an analog signal output from the pixel array 905 andconverts the sampled signal into the digital signal Ds. Theanalog-to-digital converting block 920 may perform correlated doublesampling (CDS) in order to remove fixed pattern noise inherent to thepixel.

The sensing controller 905 and the analog-to-digital converting block920 may be implemented separately from the controller 830 without beinglimited thereto. The sensing controller 905, the analog-to-digitalconverting block 920 and the controller 830 may be implemented as onecontroller.

For example, the lens moving apparatuses 100, 1100 and 3100 according tothe embodiments may be included in an optical instrument for forming animage of an object in a space using characteristics of light such asreflection, refraction, absorption, interference and diffraction for thepurpose of increasing the visual power of an eye, for recording andreproduction of the image by a lens or propagating or transmitting theimage. For example, the optical instrument according to the embodimentmay include a smartphone and a portable terminal including a cameramounted therein.

FIG. 52 is a perspective view of a portable terminal 200A according toan embodiment, and FIG. 53 is a diagram showing the configuration of theportable terminal shown in FIG. 52.

Referring to FIGS. 52 and 53, the portable terminal 200A (hereinafterreferred to as a terminal) may include a body 850, a wirelesscommunication unit 710, an A/V input unit 720, a sensing unit 740, aninput/output unit 750, a memory unit 760, an interface unit 770, acontroller 780 and a power supply 790.

The body 850 shown in FIG. 52 has a bar shape without being limitedthereto and may have various structure such as a slide type, a foldingtype, a switching type and a swirl type, in which two or more sub-bodiesare relatively movably coupled.

The body 850 may include a case (a casing, a housing, a cover, etc.)forming the appearance thereof. For example, the body 850 may be dividedinto a front case 851 and a rear case 852. Various electronic parts ofthe terminal may be provided in a space formed between the front case851 and the rear case 852.

The wireless communication unit 710 may include one or more modulescapable of performing wireless communication between the terminal 200Aand a wireless communication system or between the terminal 200A and anetwork in which the terminal 200A is located. For example, the wirelesscommunication unit 710 may include a broadcast receiving module 711, amobile communication module 712, a wireless Internet module 713, ashort-range communication module 714 and a location information module715.

The A/V input unit 720 is used to input an audio signal or a videosignal and may include a camera 721 and a microphone 722.

The camera 721 may include camera modules 200 and 200-1 according to theembodiments shown in FIGS. 15b and 29.

The sensing unit 740 may detect the current state of the terminal 200A,such as the open/closed state of the terminal 200A, the position of theterminal 200A, contact or non-contact of a user, the orientation of theterminal 200A, and acceleration/deceleration of the terminal 200A andgenerate a sensing signal for controlling operation of the terminal200A. For example, if the terminal 200A is a slide phone, whether theslide phone is open or closed may be sensed. In addition, the sensingunit may sense whether the power supply unit 790 supplies power orwhether the interface unit 770 is connected to an external device.

The input/output unit generates input or output related to a visual,auditory or tactile sense. The input/output unit 750 may generate inputdata for controlling operation of the terminal 200A and displayinformation processed by the terminal 200A.

The input/output unit 750 may include a keypad 730, a display module751, an acoustic output module 752 and a touchscreen panel 753. Thekeypad 730 may generate input data by keypad input.

The display module 751 may include a plurality of pixels, the colors ofwhich are changed according to electrical signals. For example, thedisplay module 751 may include at least one of a liquid crystal display,a thin film transistor-liquid crystal display, an organic light emittingdiode display, a flexible display and a three-dimensional (3D) display.

The acoustic output module 752 may output audio data received from thewireless communication unit 710 in a call signal reception mode, atelephone conversation mode, a recording mode, a voice recognition modeor a broadcast reception mode or output audio data stored in the memoryunit 760.

The touchscreen panel 753 may convert change in capacitance caused byuser touch in a specific area of the touchscreen into an electricalinput signal.

The memory unit 760 may store a program for processing and control ofthe controller 780 and temporarily store input/output data (e.g., atelephone directory, a message, audio, a still image, a picture, amoving image, etc.). For example, the memory unit 760 may store an imagecaptured by the camera 721, e.g., a picture or a moving image.

The interface unit 770 serves as an interface with an external deviceconnected to the terminal 200A. The interface unit 770 may receive poweror data from the external device and transmit the power or the data tothe elements of the terminal 200A or may transmit data of the terminal200A to the external device. For example, the interface unit 770 mayinclude wired or wireless headset ports, external charger ports, wiredor wireless data ports, memory card ports, ports for connecting a devicehaving an identification module, audio input/output (I/O) ports, videoI/O ports, earphone ports, and the like.

The controller 780 typically functions to control overall operation ofthe terminal 200A. For example, the controller 780 may perform controlor processing related to voice call, data communication, video call,etc.

The controller 780 may include a multimedia module 781 for reproducingmultimedia. The multimedia module 781 may be implemented inside thecontroller 780 or separately from the controller 780.

The controller 780 may include a display controller 782 for generatingdisplay control signals for driving the display 751 and a cameracontroller 783 for generating camera control signals for driving thecamera 721.

The controller 780 may perform a pattern recognition process forrespectively recognizing handwriting input or drawing input performed onthe touchscreen as characters and images.

The power supply unit 790 may receive external power or internal powerand supply power necessary for operation of the elements, under controlof the controller 780.

The features, structures, effects and the like described in theembodiments are included in at least one embodiment and are notnecessarily limited to only one embodiment. Further, the features,structures, effects, and the like illustrated in the embodiments can becombined and modified by other persons having ordinary skill in the art,to which the embodiments pertain. Therefore, differences related to suchmodifications and applications should be interpreted as being within thescope of the present disclosure.

INDUSTRIAL APPLICABILITY

The embodiment may be used in a lens moving apparatus capable ofreducing noise of a voltage induced in a second coil and improvingaccuracy of autofocus operation, and a camera module and opticalinstrument including the same.

1. A camera module comprising: a housing; a bobbin disposed in thehousing and configured to move in a first direction parallel to anoptical axis; a base disposed below the housing; a first circuit boarddisposed on an upper surface of the base and comprising a terminalmember disposed on an outer surface of the base; and a solder disposedon a front surface of the terminal member and a back surface of theterminal member.
 2. The camera module according to claim 1, wherein thefirst circuit board comprises: at least one connection terminal disposedon the front surface of the terminal member; and at least one dummyterminal disposed on the back surface of the terminal member.
 3. Thecamera module according to claim 2, wherein the solder is in contactwith the at least one connection terminal and the at least one dummyterminal.
 4. The camera module according to claim 1, wherein the solderis disposed on a lower surface of the terminal member connecting thefront surface of the terminal member and the back surface of theterminal member.
 5. The camera module according to claim 2, wherein theat least one dummy terminal overlaps the at least one connectionterminal in a direction perpendicular to the front surface of theterminal member.
 6. The camera module according to claim 1, wherein thefirst circuit board comprises a plurality of connection terminals and aplurality of dummy terminals, and wherein the plurality of dummyterminals are spaced apart from each other.
 7. The camera moduleaccording to claim 2, wherein the at least one terminal member comprisesa first insulating layer, a first conductive layer disposed on an uppersurface of the first insulating layer, a second conductive layerdisposed on a lower surface of the first insulating layer, a secondinsulating layer disposed on the first conductive layer, and a thirdinsulating layer disposed below the second conductive layer, and whereinthe at least one connection terminal is a region of the first conductivelayer exposed from the second insulating layer, and wherein the at leastone dummy terminal is a region of the second conductive layer exposed tothe third insulating layer.
 8. The camera module according to claim 2,wherein the at least one dummy terminal is in contact with one end ofthe back surface of the terminal member, and wherein the at least oneconnection terminal is contact with one end of the front surface of theterminal member.
 9. The camera module according to claim 2, wherein anarea of the at least one dummy terminal is less than an area of the atleast one connection terminal.
 10. The camera module according to claim2, wherein a length of the at least one dummy terminal is shorter than alength of the at least one connection terminal corresponding thereto ina longitudinal direction of the terminal member, and wherein a length ofthe at least one dummy terminal in a direction perpendicular to alongitudinal direction of the terminal member is shorter than a lengthof the at least one connection terminal corresponding thereto.
 11. Thecamera module according to claim 2, wherein the base comprises a grooveopposite to the at least one dummy terminal provided in a lower end ofan outer surface of the base.
 12. The camera module according to claim9, wherein the base comprises a supporting portion supporting theterminal member, and wherein the groove is provided in a lower end of anouter surface of the supporting portion.
 13. The camera module accordingto claim 1, comprising: a first coil disposed on the bobbin; a magnetdisposed on the housing; a second coil disposed on the first circuitboard to face the magnet; an elastic member coupled to the bobbin andthe housing; and a support member electrically connecting the elasticmember and the first circuit board.
 14. The camera module according toclaim 1, wherein a gap is formed between an outer surface of the baseand the dummy terminal.
 15. The camera module according to claim 14,wherein a distance between the outer surface of the base and the dummyterminal is 70 μm to 80 μm.
 16. The camera module according to claim 1,comprising a second circuit board disposed under the first circuit boardand comprising a pad, wherein the solder is disposed between theterminal member and the pad.
 17. The camera module according to claim 2,comprising a second circuit board disposed under the first circuit boardand comprising a pad, wherein the solder is adhered to the at least onedummy terminal and the at least one connection terminal correspondingthereto.
 18. A camera module comprising: a housing; a bobbin disposed inthe housing; a first coil disposed on the bobbin; a magnet disposed onthe housing; a base disposed under the housing; and a first circuitboard disposed on the base and comprising a terminal member disposed onan outer side surface of the base; a second circuit board disposed underthe first circuit board; an image sensor disposed on the second circuitboard; and a solder disposed between a front surface of the terminalmember and the second circuit board and between a back surface of theterminal member and the second circuit board.
 19. The camera moduleaccording to claim 18, wherein the second circuit board comprises a pad,wherein the terminal member comprises a connection terminal disposed onthe front surface of the terminal member and a dummy terminal disposedon the back surface of the terminal member, and wherein the solder isadhered to the connection terminal, the dummy terminal, and the pad ofthe second circuit board.
 20. A camera module comprising: a housing; abobbin disposed in the housing and configured to move in a firstdirection parallel to an optical axis; and a base disposed below thehousing.